Amal H. Alharbi, Hanan A. Hosni Mahmoud*
CMC-Computers, Materials & Continua, Vol.73, No.3, pp. 5755-5769, 2022, DOI:10.32604/cmc.2022.032212
Abstract In the last decades, technology has used Copper for IC interconnect and it has been the best material used in the wire downsizing. However, Copper is now showing inefficiency as downscaling is getting deeper. Recent research starts to show Tungsten (W) as a possible replacement, for its better downsizing characteristic. The scaling-down of interconnects dimension has to be augmented with thin diffusion layers. It is crucial to subdue tungsten diffusion in the nickel-based thermal spray Flexicord (NiCrAlY) coating layers. Inappropriately, diffusion barriers with thicknesses less than 4.3 nm do not to execute well. With the introduction of two dimensional layers,… More >
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