Zone-Ching Lin1and Ren-Yuan Wang1
CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 247-272, 2010, DOI:10.3970/cmc.2010.016.247
Abstract The paper establishes a new three-dimensional quasi-steady molecular statics nanoscale abrasive cutting model to investigate the abrasive cutting behavior in the downpressing and abrasive cutting process of a workpiece in chemical mechanical polishing (CMP) process. The downpressing and abrasive cutting process is a continuous process. The abrasive cutting process is done after the single abrasive particle has downpressed and penetrated a workpiece to a certain depth of a workpiece. The paper analyzes the effects of the abrasive particles with different diameters on action force. It also analyzes the action force change of abrasive particles with different diameters on the projected… More >
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