Wen-Hwa Chen1,2, Tsung-Yu Huang1
CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 63-84, 2010, DOI:10.3970/cmc.2010.020.063
Abstract The contact characteristics between a droplet and a microchip/binding site strongly affect the accuracy of self-alignment in the self-assembly of micro-electronic-mechanical systems. This study is mainly to implement the Surface Evolver Program, which is commonly adopted for studying surface shaped by surface tension and other energies, to investigate comprehensively the contact characteristics between the small droplet and the microchip/binding site. The details of changes in the contact line and the contact area when the microchip is subjected to translation, compression, yawing and rolling are drawn. The three-dimensional deformation of the droplet between the microchip and the binding site is also… More >
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