Lanqi Chen, Yuwei Wang, Cong Qi^*, Zhibo Tang, Zhen Tian

FDMP-Fluid Dynamics & Materials Processing, Vol.18, No.5, pp. 1205-1227, 2022, DOI:10.32604/fdmp.2022.021200

Abstract Nowadays, the utilization rate of electronic products is increasing while showing no obvious sign of reaching a limit. To solve the associated “internal heat generation problem”, scientists have proposed two methods or strategies. The first approach consists of replacing the heat exchange medium with a nanofluid. However, the high surface energy of the nanoparticles makes them prone to accumulate along the heat transfer surface. The second method follows a different approach. It tries to modify the surface structure of the electronic components in order to reduce the fluid-dynamic drag and improve the rate of heat exchange. This article reviews these… More > Graphic Abstract

Ahmad Y. Alqassim^*, Mohamed S. Mahfouz, Mohammed M. Hakami, Abdullah A. Al Faqih, Ahmad A. Shugairi, Malek R. Alsanosy, Ahmed Y. Rayyani, AbdulAziz Y. Albrraq, Mohammed A. Muaddi, Abdullah A. Alharbi

International Journal of Mental Health Promotion, Vol.24, No.2, pp. 251-262, 2022, DOI:10.32604/ijmhp.2022.019000

Abstract Background: Adolescence is a critical, multifactorial developmental phase. With the current pandemic of COVID-19, excessive using of electronic devices is a public health concern. The aim of this study is to investigate the relationship between depression and the use of electronic devices among secondary school children in Jazan, Saudi Arabia during the COVID-19 pandemic. Materials and Methods: The study is an observational, cross-sectional study. Data was collected using an anonymous online survey instrument. including the Depression Anxiety Stress Scale. Results: A total of 427 participants were included in the study. The prevalence of depression, anxiety, and stress in our study… More >

Linsen Zhu¹, Jiang Zhou², Xuejun Fan²

CMC-Computers, Materials & Continua, Vol.39, No.2, pp. 113-134, 2014, DOI:10.3970/cmc.2014.039.113

Abstract In this paper, a damage mechanics-based continuum theory is developed for the coupled analysis of moisture vaporization, moisture absorption and desorption, heat conduction, and mechanical stress for a reflow process in microelectronic devices. The extremely compliant film has been used in wafer level lamination process. Such a soft film experiences cohesive rupture subjected to moisture absorption during reflow. The numerical simulation results have demonstrated that vapor pressure due to moisture vaporization is the dominant driving force for the failures. The correlation between the vapor pressure evolution and the film rupture observed from the experiments have been established through two case… More >