Abir Zaidi¹, Esraa Mousa Ali², Abdullah G. Alharbi³, Salah Ud-Din Khan⁴, Mohammad Alsharef⁵, Mohammed S. Alzaidi⁵, Sherif S. M. Ghoneim^5,*

CMC-Computers, Materials & Continua, Vol.73, No.2, pp. 3861-3877, 2022, DOI:10.32604/cmc.2022.029889

Abstract The article presents a miniaturized monopole antenna dedicated to modern flexible electronic systems. The antenna combines three fundamental properties in a single structure. Firstly, it is characterized by a compact size compared to the state-of-the-art literature with an overall size of 18 × 18 × 0.254 mm³, secondly, the proposed antenna integrates the reconfigurability function of frequency, produced by means of a Positive-Intrinsic-Negative (PIN) diode introduced into the radiating element. Thus, the antenna is able to switch between different frequencies and different modes, making it suitable to meet the ever-changing demands of communication systems. third, the antenna is equipped by the property of flexibility.… More >

Ronald Sabo^1*, Aleksey Yermakov², Chiu Tai Law³, Rani Elhajjar⁴

Journal of Renewable Materials, Vol.4, No.5, pp. 297-312, 2016, DOI:10.7569/JRM.2016.634114

Abstract Cellulose nanomaterials have a number of interesting and unique properties that make them well-suited for use in electronics applications such as energy harvesting devices, actuators and sensors. Cellulose nanofibrils and nanocrystals have good mechanical properties, high transparency, and low coefficient of thermal expansion, among other properties that facilitate both active and inactive roles in electronics and related devices. For example, these nanomaterials have been demonstrated to operate as substrates for flexible electronics and displays, to improve the efficiency of photovoltaics, to work as a component of magnetostrictive composites and to act as a suitable lithium ion battery separator membrane. A… More >

Hsien-Chie Cheng^1,2, Chien-Hao Ma¹, Ching-Feng Yu³, Su-Tsai Lu⁴, Wen-Hwa Chen^2,3

CMC-Computers, Materials & Continua, Vol.38, No.3, pp. 129-154, 2013, DOI:10.3970/cmc.2013.038.129

Abstract User experiences for electronic devices with high portability and flexibility, good intuitive human interfaces and low cost have driven the development of semiconductor technology toward flexible electronics and display. In this study proposes, an advanced flexible interconnect technology is proposed for flexible electronics, in which an ultra-thin IC chip having a great number of micro-bumps is bonded onto a very thin flex substrate using an epoxy-based anisotropic conductive film (ACF) to form fine-pitch and reliable interconnects or joints (herein termed ACF-typed thin-flip-chip-on-flex (TFCOF) technology). The electrical and thermal -mechanical performances of the micro-joints are the key to the feasibility and… More >