Luiz Felipe Souza Fonseca¹, Heitor do Nascimento Andrade¹, João Marcelo Fernandes Gualberto de Galiza², Raphael Abrahão¹, Hamid Boleydei³, Silvia Guillén-Lambea⁴, Monica Carvalho^1,*

Energy Engineering, Vol.122, No.8, pp. 3265-3283, 2025, DOI:10.32604/ee.2025.066218 - 24 July 2025

Abstract The application of different coatings on solar photovoltaic (PV) panels can be an efficient solution to increase performance and further mitigate the emission of greenhouse gases. This study uses the Life Cycle Assessment (LCA) methodology and the environmental payback concept to analyze the effects of the application of a nano-silica coating on a solar PV system installed in the Brazilian Northeast. Firstly, an uncoated reference 16.4 MW PV system is designed, and the detailed inventory is presented (PV panels, supporting structure, inverters, junction boxes, cables, transportation, maintenance and operation—including the replacement of equipment). The results… More > Graphic Abstract

Mohammad Khalid Imam Rahmani^*

CMC-Computers, Materials & Continua, Vol.71, No.3, pp. 4895-4913, 2022, DOI:10.32604/cmc.2022.023837 - 14 January 2022

Abstract In the present era, a very huge volume of data is being stored in online and offline databases. Enterprise houses, research, medical as well as healthcare organizations, and academic institutions store data in databases and their subsequent retrievals are performed for further processing. Finding the required data from a given database within the minimum possible time is one of the key factors in achieving the best possible performance of any computer-based application. If the data is already sorted, finding or searching is comparatively faster. In real-life scenarios, the data collected from different sources may not… More >

Mohamed S. El-Genk^a,b,c,∗, Amir F. Ali^a,c

Frontiers in Heat and Mass Transfer, Vol.3, No.4, pp. 1-14, 2012, DOI:10.5098/hmt.v3.4.3001

Abstract Advanced spreaders for cooling a 10 x 10 mm underlying computer chip with a central hot spot (CHS) could remove > 85 W of dissipated thermal power at junctions’ temperature < 100o C. The spreaders comprise a 1.6 - 3.2 mm thick Cu substrate and an 80-μm thick micro-porous copper (MPC) surface cooled by saturation nucleate boiling of PF-5060 dielectric liquid. Investigated are the effects of varying the heat flux at the chip’s 1 and 4 mm² CHS and the impedance of thermal interface material (TIM) between the Cu substrate and underlying chip. Results confirmed the… More >