Mohamed S. El-Genk^a,b,c,∗, Amir F. Ali^a,c

Frontiers in Heat and Mass Transfer, Vol.3, No.4, pp. 1-14, 2012, DOI:10.5098/hmt.v3.4.3001

Abstract Advanced spreaders for cooling a 10 x 10 mm underlying computer chip with a central hot spot (CHS) could remove > 85 W of dissipated thermal power at junctions’ temperature < 100o C. The spreaders comprise a 1.6 - 3.2 mm thick Cu substrate and an 80-μm thick micro-porous copper (MPC) surface cooled by saturation nucleate boiling of PF-5060 dielectric liquid. Investigated are the effects of varying the heat flux at the chip’s 1 and 4 mm² CHS and the impedance of thermal interface material (TIM) between the Cu substrate and underlying chip. Results confirmed the effectiveness of the MPC… More >

Mohammad Khalid Imam Rahmani^*

CMC-Computers, Materials & Continua, Vol.71, No.3, pp. 4895-4913, 2022, DOI:10.32604/cmc.2022.023837

Abstract In the present era, a very huge volume of data is being stored in online and offline databases. Enterprise houses, research, medical as well as healthcare organizations, and academic institutions store data in databases and their subsequent retrievals are performed for further processing. Finding the required data from a given database within the minimum possible time is one of the key factors in achieving the best possible performance of any computer-based application. If the data is already sorted, finding or searching is comparatively faster. In real-life scenarios, the data collected from different sources may not be in sorted order. Sorting… More >