Liqun Zhou1,*, Weilin Yang1, Chaojie Li2, Shi Lin3
Frontiers in Heat and Mass Transfer, Vol.22, No.1, pp. 157-173, 2024, DOI:10.32604/fhmt.2023.045135
Abstract The power density of electronic components grows continuously, and the subsequent heat accumulation and temperature increase inevitably affect electronic equipment’s stability, reliability and service life. Therefore, achieving efficient cooling in limited space has become a key problem in updating electronic devices with high performance and high integration. Two-phase immersion is a novel cooling method. The computational fluid dynamics (CFD) method is used to investigate the cooling performance of two-phase immersion cooling on high-power electronics. The two-dimensional CFD model is utilized by the volume of fluid (VOF) method and Reynolds Stress Model. Lee’s model was employed to calculate the phase change… More >
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