Yifan Li1, Congzhe Zhu1, Zhihan Lyu2,*, Bin Yang1,3,*, Thomas Olofsson3
Energy Engineering, Vol.122, No.9, pp. 3525-3553, 2025, DOI:10.32604/ee.2025.067902
- 26 August 2025
Abstract The growth of computing power in data centers (DCs) leads to an increase in energy consumption and noise pollution of air cooling systems. Chip-level cooling with high-efficiency coolant is one of the promising methods to address the cooling challenge for high-power devices in DCs. Hybrid nanofluid (HNF) has the advantages of high thermal conductivity and good rheological properties. This study summarizes the numerical investigations of HNFs in mini/micro heat sinks, including the numerical methods, hydrothermal characteristics, and enhanced heat transfer technologies. The innovations of this paper include: (1) the characteristics, applicable conditions, and scenarios of… More >