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  • Open Access

    ARTICLE

    Numerical Investigation on Thermal Performance of Two-Phase Immersion Cooling Method for High-Power Electronics

    Liqun Zhou1,*, Weilin Yang1, Chaojie Li2, Shi Lin3

    Frontiers in Heat and Mass Transfer, Vol.22, No.1, pp. 157-173, 2024, DOI:10.32604/fhmt.2023.045135

    Abstract The power density of electronic components grows continuously, and the subsequent heat accumulation and temperature increase inevitably affect electronic equipment’s stability, reliability and service life. Therefore, achieving efficient cooling in limited space has become a key problem in updating electronic devices with high performance and high integration. Two-phase immersion is a novel cooling method. The computational fluid dynamics (CFD) method is used to investigate the cooling performance of two-phase immersion cooling on high-power electronics. The two-dimensional CFD model is utilized by the volume of fluid (VOF) method and Reynolds Stress Model. Lee’s model was employed to calculate the phase change… More > Graphic Abstract

    Numerical Investigation on Thermal Performance of Two-Phase Immersion Cooling Method for High-Power Electronics

  • Open Access

    ARTICLE

    ADVANCED SPREADERS FOR ENHANCED COOLING OF HIGH POWER CHIPS

    Mohamed S. El-Genka,b,c,∗, Amir F. Alia,c

    Frontiers in Heat and Mass Transfer, Vol.3, No.4, pp. 1-14, 2012, DOI:10.5098/hmt.v3.4.3001

    Abstract Advanced spreaders for cooling a 10 x 10 mm underlying computer chip with a central hot spot (CHS) could remove > 85 W of dissipated thermal power at junctions’ temperature < 100o C. The spreaders comprise a 1.6 - 3.2 mm thick Cu substrate and an 80-μm thick micro-porous copper (MPC) surface cooled by saturation nucleate boiling of PF-5060 dielectric liquid. Investigated are the effects of varying the heat flux at the chip’s 1 and 4 mm2 CHS and the impedance of thermal interface material (TIM) between the Cu substrate and underlying chip. Results confirmed the effectiveness of the MPC… More >

  • Open Access

    ARTICLE

    The Use of Single-Phase Immersion Cooling by Using Two Types of Dielectric Fluid for Data Center Energy Savings

    Nugroho Agung Pambudi*, Awibi Muhamad Yusuf, Alfan Sarifudin

    Energy Engineering, Vol.119, No.1, pp. 275-286, 2022, DOI:10.32604/EE.2022.017356

    Abstract Data centers are recognized as one of the most important aspects of the fourth industrial revolution since conventional data centers are inefficient and have dependency on high energy consumption, in which the cooling is responsible for 40% of the usage. Therefore, this research proposes the immersion cooling method to solving the high energy consumption of data centers by cooling its component using two types of dielectric fluids. Four stages of experimental methods are used, such as fluid types, cooling effectiveness, optimization, and durability. Furthermore, benchmark software is used to measure the CPU maximum work with the temperature data performed for… More >

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