Yuhang Jing¹, Ming Hu^2,3

CMC-Computers, Materials & Continua, Vol.38, No.1, pp. 43-59, 2013, DOI:10.3970/cmc.2013.038.043

Abstract Nanostructuring of thermoelectric materials bears promise for manipulating physical parameters to improve the energy conversion efficiency of thermoelectrics. In this paper the thermal transport in Si/Ge superlattice nanotubes is investigated by performing nonequilibrium molecular dynamics simulations aiming at realizing low thermal conductivity by surface roughening. Our calculations revealed that the thermal conductivity of Si/Ge superlattice nanotubes depends nonmonotonically on periodic length and increases as the wall thickness increases. However, the thermal conductivity is not sensitive to the inner diameters due to the strong surface scattering at thin wall thickness. In addition, introducing roughness onto the superlattice nanotubes surface can destroy… More >

F. Marín¹, F. Alhama¹, J.A. Moreno¹

CMC-Computers, Materials & Continua, Vol.43, No.1, pp. 1-20, 2014, DOI:10.3970/cmc.2014.043.001

Abstract The field of nanotribology in the last decades was established through the introduction of Atomic Force/Friction Force Microscopes. However, our theoretical understanding of the individual processes involved in friction force microscopy is limited. This work designs a reliable and efficient model for the stickslip phenomenon, following the rules of network simulation. The model is able to manage different types of potential between the tip and the sample surface, allowing different kinds of sample material and microscope tip properties to be simulated with only minor changes in the code. The most analysed tribological materials in technical literature are simulated to test… More >

Zone-Ching Lin¹and Ren-Yuan Wang¹

CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 247-272, 2010, DOI:10.3970/cmc.2010.016.247

Abstract The paper establishes a new three-dimensional quasi-steady molecular statics nanoscale abrasive cutting model to investigate the abrasive cutting behavior in the downpressing and abrasive cutting process of a workpiece in chemical mechanical polishing (CMP) process. The downpressing and abrasive cutting process is a continuous process. The abrasive cutting process is done after the single abrasive particle has downpressed and penetrated a workpiece to a certain depth of a workpiece. The paper analyzes the effects of the abrasive particles with different diameters on action force. It also analyzes the action force change of abrasive particles with different diameters on the projected… More >