Xuelian Zhang¹, Junjie Liu^1,*, Jian Li², Zhihong Liang¹, Han Jiang¹, Guozheng Kang¹, Qianhua Kan^1,*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.25, No.3, pp. 1-1, 2023, DOI:10.32604/icces.2023.010142

Abstract The last decades have witnessed the real and huge potential applications of hydrogels in various areas, including biomedicine, soft robotics, and flexible electronics. The fatigue of hydrogels challenges their reliability and longevity in service, but the related works are not sufficient. In this work, stress-controlled cyclic fatigue tests of a double-network tough hydrogel, consisting of polyacrylamide and alginate polymer networks, under pure shear deformation are investigated. The effects of peak stress, loading rate, peak stress holding time, and environmental relative humidity on the fatigue of the double-network tough hydrogel are considered. The results show that with the increase in peak… More >

Hung-Chun Yang, Tz-Cheng Chiu^*

CMES-Computer Modeling in Engineering & Sciences, Vol.128, No.2, pp. 639-668, 2021, DOI:10.32604/cmes.2021.016159

Abstract An implicit integration scheme was developed for simulating the viscoplastic constitutive behavior of Sn3.0Ag0.5Cu solder and programmed into a user material subroutine of the finite element software ANSYS. The numerical procedure first solves the essential state variables by using a three-level iterative procedure, and updates the remaining stress and state variables accordingly. The numerical implementation was applied to consider the responses of solder joints in an electronic assembly under temperature cycling condition. The viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints. More >