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  • Open Access

    ARTICLE

    Effect of An Initial Stress on SH-Type GuidedWaves Propagating in a Piezoelectric Layer Bonded on A Piezomagnetic Substrate

    Guoquan Nie1,2, Jinxi Liu1, Ming Li1

    CMC-Computers, Materials & Continua, Vol.48, No.3, pp. 133-145, 2015, DOI:10.3970/cmc.2015.048.133

    Abstract Propagation of SH-type guided waves in a layered structure with an invariant initial stress is studied, where a piezoelectric thin layer is perfectly bonded on a piezomagnetic substrate. Both the layer and the substrate possess transversely isotropic property. The dispersion relations of SH waves are obtained for four kinds of different electro-magnetic boundary conditions. The effects of initial stress, thickness ratio and electro-magnetic boundary conditions on the propagation behaviors are analyzed in detail. The numerical results show that: 1) The positive initial stresses make the phase velocity increasing, while the negative initial stresses decrease the phase velocity; 2) The smaller… More >

  • Open Access

    ARTICLE

    Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation

    Zhicheng Ou1, Xiaohu Yao1, Xiaoqing Zhang1,2, Xuejun Fan3

    CMC-Computers, Materials & Continua, Vol.44, No.3, pp. 205-222, 2014, DOI:10.3970/cmc.2014.044.205

    Abstract The buckling of a thin film on a compressible compliant substrate in large deformation is studied. A finite-deformation theory is developed to model the film and the substrate under different original strain-free configurations. The neo-Hookean constitutive relation is applied to describe the substrate. Through the perturbation analysis, the analytical solution for this highly nonlinear system is obtained. The buckling wave number, amplitude and critical condition are obtained. Comparing with the traditional linear model, the buckling amplitude decreases. The wave number increases and relates to the prestrain. With the increment of Poisson’s ratio of the substrate, the buckling wave number increases,… More >

  • Open Access

    ARTICLE

    Indentation Load-Displacement Relations for the Spherical Indentation of Elastic Film/Substrate Structures

    S. N.V.R.K. Kurapati1, Y. C. Lu1, F. Yang2

    CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 1-18, 2010, DOI:10.3970/cmc.2010.020.001

    Abstract The spherical indentation of elastic film /substrate structures is analyzed using the finite element method. The load-displacement curves of the film /substrate structures of various configurations are obtained and analyzed. A generalized power law relation is established, which can be used to analyze the load-displacement curve of elastic film /substrate systems under spherical indentations. The indentation load is dependent on the modulus ratio of the film to the substrate and film thickness. A semi-analytical expression for the power of the power law relation is also obtained as a function of the normalized film thickness and normalized film modulus, which can… More >

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