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Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling

Bin Zhang1,*, Xuanyan Lu1, Zhigang Qin2, Yibo Mo3, Chenwei Wang1, Sihui Hao1, Yixiang Song1, Jianyun Xu1, Zhifeng Zhang4, Xu Long1,*

1 Department of Engineering Mechanics, School of Mechanics and Transportation Engineering, Northwestern Polytechnical University, Xi’an, China
2 East Energy Storage Technology Co., Ltd., Xi’an, China
3 Beijing Frontier Power Technology Co., Ltd., Beijing, China
4 Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA, USA

* Corresponding Authors: Bin Zhang. Email: email; Xu Long. Email: email

Computer Modeling in Engineering & Sciences 2026, 148(3), 17 https://doi.org/10.32604/cmes.2026.086481

Abstract

Nanofluid-cooled microchannel heat sinks (NCMHS) feature high heat dissipation efficiency and serve as a critical thermal management solution for electronic devices. This study employs a computationally efficient multi-layer modeling approach to conduct three-layer topological optimisation of the NCMHS. The flow and heat transfer within the NCMHS are described using a single-phase nanofluid-based thermofluid model that accounts for temperature-sensitive fluid properties. On this basis, a three-layer thermofluid model of the NCMHS is constructed by introducing assumptions regarding the velocity profile and an adaptive temperature profile in the thickness direction, together with the interlayer coupled heat flux derived from Fourier’s law. This model describes the conjugate heat transfer in the fluid channel and the heat conduction in the top and bottom plates in a two-dimensional manner, while comprehensively accounting for the influences of out-of-plane flow boundaries and heat transfer. Comparative validation against a full three-dimensional model demonstrates that the developed three-layer model achieves good numerical consistency. Based on this model, a three-layer topological optimisation framework for the NCMHS is further established by representing the channel layout with a fictitious density field. Numerical examples investigate the influences of temperature-sensitive fluid properties, pressure drop, heat source characteristics, and nanofluid properties on the optimized design of the NCMHS. The results elucidate that temperature-sensitive fluid properties significantly influence the optimized design. As the pressure drop increases, the optimized design tends to become more complex. In addition, reducing the nanoparticle volume fraction promotes the emergence of more branched channels in the optimized design.

Keywords

Topological optimisation; convective heat transfer; three-layer thermofluid model; nanofluid; heat sinks; temperature-sensitive fluid properties

Supplementary Material

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Cite This Article

APA Style
Zhang, B., Lu, X., Qin, Z., Mo, Y., Wang, C. et al. (2026). Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling. Computer Modeling in Engineering & Sciences, 148(3), 17. https://doi.org/10.32604/cmes.2026.086481
Vancouver Style
Zhang B, Lu X, Qin Z, Mo Y, Wang C, Hao S, et al. Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling. Comput Model Eng Sci. 2026;148(3):17. https://doi.org/10.32604/cmes.2026.086481
IEEE Style
B. Zhang et al., “Topological Optimisation Design of Nanofluid-Cooled Microchannel Heat Sink Using a Three-Layer Thermofluid Model for Electronics Cooling,” Comput. Model. Eng. Sci., vol. 148, no. 3, pp. 17, 2026. https://doi.org/10.32604/cmes.2026.086481



cc Copyright © 2026 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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