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Lattice Boltzmann Simulation of Nanoparticle Transport and Attachment in a Microchannel Heat Sink

Xiaokang Tian1, Kai Yue1,2,*, Yu You1,2, Yongjian Niu1, Xinxin Zhang1,2

1 School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing, 100083, China
2 Shunde Graduate School of University of Science and Technology Beijing, Shunde, 528399, China

* Corresponding Author: Kai Yue. Email: email

Fluid Dynamics & Materials Processing 2021, 17(2), 301-317. https://doi.org/10.32604/fdmp.2021.013521

Abstract

The heat transfer performances of a microchannel heat sink in the presence of a nanofluid can be affected by the attachment of nanoparticle (NP) on the microchannel wall. In this study, the mechanisms underlying NP transport and attachment are comprehensively analyzed by means of a coupled double-distribution-function lattice Boltzmann model combined with lattice-gas automata. Using this approach, the temperature distribution and the two-phase flow pattern are obtained for different values of the influential parameters. The results indicate that the number of attached NPs decrease exponentially as their diameter and the fluid velocity grow. An increase in the wall temperature leads to an increase of the attached NPs, e.g., the Al2O3 NPs attached on the CuO microchannel wall increases by 105.8% in the range between 293 K and 343 K. There are more attached NPs in microchannels with an irregular structure. The tendency of SiO2 NP to attach to the PDMS (polydimethylsiloxane), Fe and Cu walls is less significant than that for Al2O3 and CuO NP; Moreover, NPs detach from the PDMS microchannel wall more easily than from the Cu and Fe microchannel walls. The SiO2 attachment layer has the greatest influence on the heat transfer performance although its thickness is thinner than that for Al2O3 and CuO NPs under the same conditions.

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APA Style
Tian, X., Yue, K., You, Y., Niu, Y., Zhang, X. (2021). Lattice boltzmann simulation of nanoparticle transport and attachment in a microchannel heat sink. Fluid Dynamics & Materials Processing, 17(2), 301-317. https://doi.org/10.32604/fdmp.2021.013521
Vancouver Style
Tian X, Yue K, You Y, Niu Y, Zhang X. Lattice boltzmann simulation of nanoparticle transport and attachment in a microchannel heat sink. Fluid Dyn Mater Proc. 2021;17(2):301-317 https://doi.org/10.32604/fdmp.2021.013521
IEEE Style
X. Tian, K. Yue, Y. You, Y. Niu, and X. Zhang "Lattice Boltzmann Simulation of Nanoparticle Transport and Attachment in a Microchannel Heat Sink," Fluid Dyn. Mater. Proc., vol. 17, no. 2, pp. 301-317. 2021. https://doi.org/10.32604/fdmp.2021.013521



cc This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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