Open Access

REVIEW

Electronic Cooling Technologies: A Comprehensive Review of Fundamentals, Advanced Strategies, and Future Directions

Wei Tong^1,2, Chuyi Peng², Yugang Zhao^3,4,*

1 State Key Laboratory of Engines, School of Mechanical Engineering, Tianjin University, Tianjin, China
2 Shenzhen Envicool Technology Co. Ltd., Shenzhen, China
3 School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai, China
4 Key Laboratory of Icing and Anti/De-icing, China Aerodynamics Research and Development Center, Mianyang, China

* Corresponding Author: Yugang Zhao. Email:

Frontiers in Heat and Mass Transfer 2026, 24(4), 4 https://doi.org/10.32604/fhmt.2026.087420

Received 16 June 2026; Accepted 03 August 2026; Issue published 31 August 2026

Abstract

The relentless pursuit of higher performance in electronics, driven by the demands of artificial intelligence and high-performance computing, has led to unprecedented power densities that exceed the capabilities of conventional cooling methods. This comprehensive review examines the landscape of electronic cooling technologies, spanning from fundamental heat generation mechanisms to state-of-the-art thermal management strategies. We analyze twelve distinct cooling technologies across the full performance spectrum, from conventional air cooling and heat pipes to advanced microchannel heat sinks, jet impingement, spray cooling, immersion cooling, and AI-optimized intelligent thermal management, comparing their heat transfer coefficients (10–250,000 W/m²·K), critical heat fluxes (100–1800 W/cm²), and coefficient of performance values. By synthesizing recent advances from peer-reviewed studies (2015–2026), this review provides a unified quantitative framework for understanding and selecting electronic cooling technologies, offering actionable engineering guidelines and a forward-looking roadmap for next-generation thermal management. The findings underscore that no single technology can address all thermal challenges, and future cooling solutions will increasingly rely on hybrid architectures, AI-driven optimization, advanced materials, and sustainable coolants to ensure the performance, reliability, and longevity of future electronic systems.

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Keywords

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