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Improving the Environmental Friendliness of Glued Structures Made of Thermal Wood by Preliminary Low-Temperature Plasma Treatment
Department of Architecture and Design of Wood Products, Kazan National Research Technological University, Kazan, 420015, Russia
* Corresponding Author: Ksenia Saerova. Email:
(This article belongs to the Special Issue: Advances in Eco-friendly Wood-Based Composites: Design, Manufacturing, Properties and Applications – Ⅱ)
Journal of Renewable Materials 2025, 13(9), 1829-1840. https://doi.org/10.32604/jrm.2025.02025-0076
Received 04 April 2025; Accepted 31 July 2025; Issue published 22 September 2025
Abstract
This article presents research focused on developing and scientifically substantiating a technology for producing environmentally friendly glued structures from wood treated through a two-stage process. The methodology involves preliminary thermal modification followed by high-frequency low-temperature plasma treatment. Thermal modification enhances performance characteristics such as resistance to rot, lowers hygroscopicity, and increases dimensional stability. However, it can diminish the adhesive properties of wood, complicating the bonding process. To address this challenge, the study introduces high-frequency low-temperature plasma treatment, which activates the wood surface, improving wettability and adhesion while minimizing glue consumption. Experimental results indicate that plasma treatment reduces the contact angle by 46% and adhesive consumption during bonding by 24%, thereby enhancing the environmental friendliness of the glued structures. Furthermore, this dual treatment process increases the shear strength of adhesive joints by 22.7% and bending strength of glued beams by 66.6%, demonstrating a 30% lower carbon footprint compared to conventional methods. The findings affirm the efficacy of this technology in producing building materials, particularly glued beams for large-span structures.Keywords
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Copyright © 2025 The Author(s). Published by Tech Science Press.This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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