Home / Advanced Search

  • Title/Keywords

  • Author/Affliations

  • Journal

  • Article Type

  • Start Year

  • End Year

Update SearchingClear
  • Articles
  • Online
Search Results (57)
  • Open Access

    ARTICLE

    Optimal Substrate Shape for Vesicle Adhesion on a Curved Substrate

    Wendong Shi∗,†, Xi-Qiao Feng*, Huajian Gao

    Molecular & Cellular Biomechanics, Vol.3, No.3, pp. 121-126, 2006, DOI:10.3970/mcb.2006.003.121

    Abstract When pulling a vesicle adhered on a substrate, both the force-displacement profile and the maximum force at pull-off are sensitively dependent upon the substrate shape. Here we consider the adhesion between a two-dimensional vesicle and a rigid substrate via long-range molecular interactions. For a given contact area, the theoretical pull-off force of the vesicle is obtained by multiplying the theoretical strength of adhesion and the contact area. It is shown that one may design an optimal substrate shape to achieve the theoretical pull-off force. More >

  • Open Access

    ARTICLE

    Adhesive Force of Human Hepatoma HepG2 Cells to Endothelial Cells and Expression of E-Selectin

    Guanbin Song∗,†, Toshiro Ohashi, Naoya Sakamoto, Masaaki Sato

    Molecular & Cellular Biomechanics, Vol.3, No.2, pp. 61-68, 2006, DOI:10.3970/mcb.2006.003.061

    Abstract Expression of adhesion molecules may play an important role in the interaction of tumor cells with vascular endothelial cells during tumor invasion and metastasis. In this study, the adhesive force of human hepatoma HepG2 cells to human umbilical vein endothelial cells (HUVECs) was investigated using a micropipette aspiration technique. Expression of an adhesion molecule, E-selectin, was also observed by immunofluorescence microscopy. In particular, the adhesive force after stimulation of HUVECs with recombinant human interleukin-1β (rhIL-1β) was examined. The results demonstrated that the adhesive force of HepG2 cells to stimulated HUVECs is significantly higher than that of unstimulated control cells, and… More >

  • Open Access

    ARTICLE

    Comparison between a Cohesive Zone Model and a Continuum Damage Model in Predicting Mode-I Fracture Behavior of Adhesively Bonded Joints

    K.I. Tserpes1, A.S. Koumpias1

    CMES-Computer Modeling in Engineering & Sciences, Vol.83, No.2, pp. 169-182, 2012, DOI:10.32604/cmes.2012.083.169

    Abstract In this work, a comparison between a cohesive zone model and a continuum damage model in predicting the mode-I fracture behavior of adhesively bonded joints is performed on the basis of reliability and applicability. The cohesive zone model (CZM) is based on an exponential traction law characterizing the behavior of the interface elements. The continuum damage model (CDM) is based on the stiffness degradation of adhesive elements imposed by a damage parameter. Both models have been implemented by means of a 3D finite element model. Mode-I fracture behavior of the bonded joints was characterized using the DCB specimen. Firstly, the… More >

  • Open Access

    ARTICLE

    Analysis of a Crack in a Thin Adhesive Layer between Orthotropic Materials: An Application to Composite Interlaminar Fracture Toughness Test

    L. Távara1, V. Manticˇ 1, E. Graciani1, J. Cañas1, F. París1

    CMES-Computer Modeling in Engineering & Sciences, Vol.58, No.3, pp. 247-270, 2010, DOI:10.3970/cmes.2010.058.247

    Abstract The problem of a crack in a thin adhesive layer is considered. The adherents may have orthotropic elastic behavior which allows composite laminates to be modeled. In the present work a linear elastic-brittle constitutive law of the thin adhesive layer, called weak interface model, is adopted, allowing an easy modeling of crack propagation along it. In this law, the normal and tangential stresses across the undamaged interface are proportional to the relative normal and tangential displacements, respectively. Interface crack propagation is modeled by successive breaking of the springs used to discretize the weak interface. An important feature of the BEM… More >

  • Open Access

    ARTICLE

    Effect of Residual Stresses on Wave Propagation in Adhesively Bonded Multilayered MEMS Structures

    M. Kashtalyan1,2, Y.A. Zhuk3

    CMES-Computer Modeling in Engineering & Sciences, Vol.57, No.1, pp. 1-30, 2010, DOI:10.3970/cmes.2010.057.001

    Abstract The paper investigates propagation of stationary plane longitudinal and transverse waves along the layers in adhesively bonded multilayered structures for MEMS applications in the presence of residual stresses. The multilayered structure is assumed to consist of the infinite amount of the periodically recurring layers made of two different materials possessing significantly dissimilar properties: conductive metal layer and insulating adhesive layer. It is assumed that the mechanical behaviour of both materials is nonlinear elastic and can be described with the help of the elastic Murnaghan potential depending on the three invariants of strain tensor. The problem is formulated in the framework… More >

  • Open Access

    ARTICLE

    Modeling of Structural Sandwich Plates with `Through-the-Thickness' Inserts: Five-Layer Theory

    Song-Jeng Huang1,2, Lin-Wei Chiu2

    CMES-Computer Modeling in Engineering & Sciences, Vol.34, No.1, pp. 1-32, 2008, DOI:10.3970/cmes.2008.034.001

    Abstract The composite sandwich plate is one of the most common composite structures. Local stress concentrations can be caused by localized bending effects where a load is introduced. Although a sandwich structure with an insert is one of the classical load bearing structures, little work has been conducted on the adhesive layers or inserts. This study involves a linear elasticity analysis of five-layer sandwich plates with ``through-the-thickness'' inserts, using sandwich plate theory to analyze deformation behavior. Governing equations are formulated as partial differential equations, which are solved numerically using the multi-segment integration method. Sandwich plates with ``through-the-thickness'' inserts subjected to axisymmetric… More >

  • Open Access

    ARTICLE

    Study on Shear Test of New Style Automotive Structural Adhesive using Digital Image Correlation Method

    Bin Li1, Guo-biao Yang1, Qi-rong Zhu2, Fan Ni2

    CMC-Computers, Materials & Continua, Vol.21, No.2, pp. 107-118, 2011, DOI:10.3970/cmc.2011.021.107

    Abstract In this paper, digital image correlation method (DICM) is employed to measure the shear behavior of the spot welding specimens and the ones using adhesive under quasi-static lap shear testing. The images of the specimens' surfaces are captured in real-time by CCD and corresponding computer system. DICM is subsequently used to obtained strain by correlating the images captured before and after deformation. Then, both force-displacement curves and stress-strain curves of the specimens including the cracking load are obtained. The results and analysis show that the mechanical properties of specimens using adhesive compared with the spot welding specimens have an obvious… More >

Displaying 51-60 on page 6 of 57. Per Page