Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >

I. Smojver¹, J. Sorić²

CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 13-24, 2006, DOI:10.3970/cmc.2007.003.013

Abstract The paper addresses the problem of impact on layered fibre composites. The behaviour of composite laminates under impact loading is dependent not only on the velocity but also on the mass and geometry of the impactor. Using micromechanical Mori-Tanaka approach, mechanical properties of the laminate have been calculated utilizing the material constants of the fibre and matrix. General purpose FEM software ABAQUS has been modified by means of user written subroutines for modelling of composite laminate and rigid impactor. The kinematics of the impact has been simulated using transient dynamic analysis. Employing user defined multi point constraints, delamination zones have… More >

G. Mishuris¹, A. Öchsner², G. Kuhn³

CMC-Computers, Materials & Continua, Vol.2, No.4, pp. 227-238, 2005, DOI:10.3970/cmc.2005.002.227

Abstract FEM-evaluation of imperfect transmission conditions has been performed for a modelling problem of an elastic structure with a thin intermediate interface. Very good correlations with theoretical results have been obtained. Additionally, the possible error connected with introducing the transmission conditions instead of the intermediate zone has been estimated depending on mechanical properties of the zone. More >

Marcello Lappa ¹

CMC-Computers, Materials & Continua, Vol.2, No.1, pp. 51-64, 2005, DOI:10.3970/cmc.2005.002.051

Abstract A possible approach for the investigation of a number of aspects related to the processing of immiscible alloys, made possible by recent progress in both fields of moving boundary (VOF) methods and speed of computers, is discussed. It can capture in a single numerical treatment and without limiting assumptions both macroscopic information (i.e. the macrophysical problem, heretofore treated in terms of population dynamics) and microscopic details (i.e. the microphysical problem, heretofore treated within the framework of boundary integral methods and/or under the assumption of nondeformable drops). The role played by coalescence in changing the Marangoni migration velocity is discussed together… More >

Y. C. Hon¹, L. Ling², K. M. Liew³

CMC-Computers, Materials & Continua, Vol.2, No.1, pp. 39-50, 2005, DOI:10.3970/cmc.2005.002.039

Abstract In this paper we investigate a thermal driven Micro-Electrical-Mechanical system which was originally designed for inkjet printer to precisely deliver small ink droplets onto paper. In the model, a tiny free-ended beam of metal bends and projects ink onto paper. The model is solved by using the recently developed radial basis functions method. We establish the accuracy of the proposed approach by comparing the numerical results with reported experimental data. Numerical simulations indicate that a light (low composite mass) beam is more stable as it does not oscillate much. A soft (low rigidity) beam results in a higher rate of… More >