Mohammed Yunus^*, Mohammad S. Alsoufi

Frontiers in Heat and Mass Transfer, Vol.12, pp. 1-8, 2019, DOI:10.5098/hmt.12.11

Abstract Swift cooling systems, improved microprocessor chips, processors’ performance and power usage have increased production of an enormous amount of heat and high operating temperatures due to excess heat flux density in the field of microelectronics. A rapid cooling of electronic circuits and heat dissipation for the same size of pipe with the present technology as nano size circuits critically generate high heat flux beyond 100 W/cm2 is currently the challenging task with which we are presented. Cooling in the form of heat transfer should be managed using both thermal conductivity (evaporation) and phase transition (condensation) between the two solid interfaces… More >

Yuling Zhai^*, Long Li, Zihao Xuan, Mingyan Ma, Hua Wang

FDMP-Fluid Dynamics & Materials Processing, Vol.18, No.3, pp. 629-646, 2022, DOI:10.32604/fdmp.2022.017485

Abstract The thermo-physical properties of nanofluids are highly dependent on the used base fluid. This study explores the influence of the mixing ratio on the thermal conductivity and viscosity of ZnO-CuO/EG (ethylene glycol)-W (water) hybrid nanofluids with mass concentration and temperatures in the ranges 1-5 wt.% and 25-60°C, respectively. The characteristics and stability of these mixtures were estimated by TEM (transmission electron microscopy), visual observation, and absorbance tests. The results show that 120 min of sonication and the addition of PVP (polyvinyl pyrrolidone) surfactant can prevent sedimentation for a period reaching up to 20 days. The increase of EG (ethylene glycol)… More >