Hsien-Chie Cheng^1,2, Chien-Hao Ma¹, Ching-Feng Yu³, Su-Tsai Lu⁴, Wen-Hwa Chen^2,3

CMC-Computers, Materials & Continua, Vol.38, No.3, pp. 129-154, 2013, DOI:10.3970/cmc.2013.038.129

Abstract User experiences for electronic devices with high portability and flexibility, good intuitive human interfaces and low cost have driven the development of semiconductor technology toward flexible electronics and display. In this study proposes, an advanced flexible interconnect technology is proposed for flexible electronics, in which an ultra-thin IC chip having a great number of micro-bumps is bonded onto a very thin flex substrate using an epoxy-based anisotropic conductive film (ACF) to form fine-pitch and reliable interconnects or joints (herein termed ACF-typed thin-flip-chip-on-flex (TFCOF) technology). The electrical and thermal -mechanical performances of the micro-joints are the key to the feasibility and… More >

Xing Wei^1,2, Wen Chen², Bin Chen^2,3, Bin Chen^1,4, Bin Chen², Bin Chen¹

CMC-Computers, Materials & Continua, Vol.52, No.1, pp. 53-71, 2016, DOI:10.3970/cmc.2016.052.053

Abstract A new wavelet finite element method (WFEM) is constructed in this paper and two elements for bending and free vibration problems of a stiffened plate are analyzed. By means of generalized potential energy function and virtual work principle, the formulations of the bending and free vibration problems of the stiffened plate are derived separately. Then, the scaling functions of the B-spline wavelet on the interval (BSWI) are introduced to discrete the solving field variables instead of conventional polynomial interpolation. Finally, the corresponding two problems can be resolved following the traditional finite element frame. There are some advantages of the constructed… More >