Ningning Wang¹, Caili Zhang^1,2,*, Wenqin Zhu³, Yunxuan Weng^1,2,*

Journal of Renewable Materials, Vol.8, No.9, pp. 1139-1149, 2020, DOI:10.32604/jrm.2020.09961

Abstract To clarify the effects of lignin as a biodegradable filler added into the PLA matrix, PLA/lignin composites with or without silane coupling agent of γ- (2,3-epoxypropoxy)propy trimethoxysilane (KH560) were prepared by a one-step solvent-free modification method. The effects of KH560 as a compatibilizer on the morphology, chemical structure, crystallization behavior, thermal degradative behavior as well as mechanical strength of the PLA/lignin composites were analyzed in detail. It was found that, after modification by KH560, the fractured surfaces of composites became smooth, suggested sufficient bonding between the lignin and PLA in the composites with KH560 coupling agent molecules. This result further… More >

Phornwalan Nanthananon¹, Manus Seadan², Sommai Pivsa-Art³, Hiroyuki Hamada⁴, Supakij Suttiruengwong^1,*

Journal of Renewable Materials, Vol.6, No.6, pp. 573-583, 2018, DOI:10.32604/JRM.2018.00129

Abstract Poor interfacial adhesion between biobased thermoplastics and natural fibers is recognized as a major drawback for biocomposites. To be applicable for the large-scale production, a simple method to handle is of importance. This work presented poly(lactic acid) (PLA) reinforced with short-fiber and three reactive agents including anhydride and epoxide groups were selected as compatibilizers. Biocomposites were prepared by one-step melt-mixing methods. The influence of reactive agents on mechanical, dynamic mechanical properties and morphology of PLA biocomposites were investigated. Tensile strength and storage modulus of PLA biocomposites incorporated with epoxide-based reactive agent was increased 13.9% and 37.4% compared to non-compatibilized PLA… More >

W.H. Chen¹, H.C. Cheng^2,3, C.F. Yu^1,3

CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 1-13, 2015, DOI:10.3970/cmes.2015.109.001

Abstract This study aims at exploring the interfacial adhesion strength between solder bump and four typical under bump metallurgies (UBMs), i.e., Cu/Ni, Cu/TiW, Cu/Ni/Cr and /Cu/V/Cr, at atomistic scale. The average bond length and interfacial adhesion stress of the Sn-3.5Ag/Cu/Ni, Sn-3.5Ag/Cu/TiW, Sn-3.5Ag/Cu/Ni/Cr and Sn-3.5Ag/Cu/V/Cr micro-bump interconnects are calculated through the firstprinciples density functional theory (DFT) calculation to estimate the interfacial adhesion strength between the solder bump and UBMs. In addition, by investigating the electric field effect on the average bond length and adhesive stress, the combination of solder bump and UBM with better interfacial adhesion strength and electromigration resistance ability can… More >