L. Chernin¹, K.Y. Volokh^1,2

CMC-Computers, Materials & Continua, Vol.1, No.3, pp. 259-274, 2004, DOI:10.3970/cmc.2004.001.259

Abstract The conventional approach to analysis of thin film delamination is based on the consideration of the film, which is subjected to residual stresses arising from the thermal mismatch between the film and the substrate, within the framework of the classical fracture mechanics and the structural buckling theories. Such concepts as the energy release rate and the stress intensity factors are crucial in this case.

A different approach to analysis of thin film delamination considers the effect of the compliant interface between the film and the substrate. This compliant interface is described by the traction-separation constitutive law.

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C. H. Cheng¹, S. C. Chen²

CMC-Computers, Materials & Continua, Vol.1, No.3, pp. 205-212, 2004, DOI:10.3970/cmc.2004.001.205

Abstract A shear mode piezoelectric actuator is applied to deflect the diaphragm of pressure chamber in the droplet ejector or inkjet printhead. The deflection of the bulge-diaphragm and resulting swept volume is analyzed by analytical and numerical method. With free-body treatment of the model, the analytical exact solutions for the two free bodies of bulge-diaphragm and piezoelectric beam were obtained. Also, the numerical solution by ANSYS is obtained to verify the analytical result. Besides, the whole-model solution coupling the bulge-diaphragm and piezoelectric beam together was obtained by ANSYS to compare with the result of free-body analysis. In order to estimate the… More >