Open Access

ARTICLE

Numerical Simulation on Heat Dissipation Characteristics of Electronic Components with Different Heat Sink Arrangements in High-Performance Server

Zerui Chen^*, Xin Wu, Houpeng Hu, Yang Zhou, Shang Yang

China Southern Power Grid, Electric Power Research Institute of Guizhou Power Grid Co., Ltd., Guiyang, 550002, China

* Corresponding Author: Zerui Chen. Email:

Frontiers in Heat and Mass Transfer 2025, 23(3), 991-1011. https://doi.org/10.32604/fhmt.2025.065936

Received 25 March 2025; Accepted 09 May 2025; Issue published 30 June 2025

Abstract

As the integration of electronic components in high-performance servers increases, heat generation significantly impacts performance and raises failure rates. Therefore, heat dissipation has become a critical concern in electronic circuit design. This study uses numerical simulations to investigate the heat dissipation characteristics of electronic components in air-cooled servers. By adjusting airflow speed, heat sink configurations, and the arrangement of straight-fin heat sinks, we optimize heat dissipation performance and analyze the mechanisms at different airflow speeds. The results show that, at the same airflow speed, the temperature of the heat sink is lower than that of the electronic components, creating a temperature gradient that enhances heat transfer. Compared to a front-to-back arrangement of two straight-fin heat sinks, placing the heat sinks parallel to each other results in a lower maximum component temperature and better temperature uniformity. Heat sinks with fins significantly improve heat dissipation. The heat sink with semicylindrical fins on the rib surface provides the best cooling performance. Moreover, compared to natural convection, the maximum temperature of the electronic components decreases by 56.17% and 61% when the incoming flow velocity is 6 m/s with two parallel flat ribbed heat sinks and front-to-back arrangement, respectively.

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Keywords

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