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Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste

Peng Chen*, Wentao Shi, Jian Wan, Lu Huang
Nanjing Institute of Materials Science for Electric Light Sources, Nanjing, 210015, China
* Corresponding Author: Peng Chen. Email:

Journal of Renewable Materials 2023, 11(2), 1017-1029. https://doi.org/10.32604/jrm.2023.023699

Received 10 May 2022; Accepted 02 June 2022; Issue published 22 September 2022

Abstract

The poly(epoxy-N-methylaniline) conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste. Then, this was mixed with different proportions of silver powder to prepare the lowtemperature conductive silver paste. Afterwards, the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR, DMA and SEM. The results revealed that the prepared conductive paste has good conductivity, film-forming performance, printing performance, low-temperature curing performance, and anti-aging performance. When the mass percentage of the bonding phase/conductive phase was 40/60, the lowest volume resistivity of the conductive silver paste was 4.9 × 10−6 Ω⋅cm, and the conductivity was the best.

Graphical Abstract

Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste

Keywords

Low temperature conductive silver paste; poly(epoxy-N-methylaniline); volume resistivity; conductivity

Cite This Article

Chen, P., Shi, W., Wan, J., Huang, L. (2023). Effect of Introducing Conductive Organic Carrier on Properties of Low-Temperature Conductive Silver Paste. Journal of Renewable Materials, 11(2), 1017–1029.



This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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