Zone-Ching Lin¹and Ren-Yuan Wang¹

CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 247-272, 2010, DOI:10.3970/cmc.2010.016.247

Abstract The paper establishes a new three-dimensional quasi-steady molecular statics nanoscale abrasive cutting model to investigate the abrasive cutting behavior in the downpressing and abrasive cutting process of a workpiece in chemical mechanical polishing (CMP) process. The downpressing and abrasive cutting process is a continuous process. The abrasive cutting process is done after the single abrasive particle has downpressed and penetrated a workpiece to a certain depth of a workpiece. The paper analyzes the effects of the abrasive particles with different diameters on action force. It also analyzes the action force change of abrasive particles with different diameters on the projected… More >

O. U. Ojeda¹ and T. Çagınˇ ¹

CMC-Computers, Materials & Continua, Vol.16, No.2, pp. 127-174, 2010, DOI:10.3970/cmc.2010.016.127

Abstract The large discrepancy in length and time scales at which characteristic processes of energetic materials are of relevance pose a major challenge for current simulation techniques. We present a systematic study of crystalline energetic materials of different sensitivity and analyze their properties at different theoretical levels. Information like equilibrium structures, vibrational frequencies, conformational rearrangement and mechanical properties like stiffness and elastic properties can be calculated within the density functional theory (DFT) using different levels of approximations. Dynamical properties are obtained by computations using molecular dynamics at finite temperatures through the use of classical force fields. Effect of defects on structure… More >

J. Ghanbari¹, R. Naghdabadi^1,2

CMC-Computers, Materials & Continua, Vol.10, No.1, pp. 41-64, 2009, DOI:10.3970/cmc.2009.010.041

Abstract Continuum-based modeling of nanostructures is an efficient and suitable method to study the behavior of these structures when the deformation can be considered homogeneous. This paper is concerned about multiscale nonlinear tensorial constitutive modeling of carbon nanostructures based on the interatomic potentials. The proposed constitutive model is a tensorial equation relating the second Piola-Kirchhoff stress tensor to Green-Lagrange strain tensor. For carbon nanotubes, some modifications are made on the planar representative volume element (RVE) to account for the curved atomic structure resulting a non-planar RVE. Using the proposed constitutive model, the elastic behavior of the graphene sheet and carbon nanotube… More >

G. Haasemann¹, M. Kästner¹ and V. Ulbricht¹

CMC-Computers, Materials & Continua, Vol.3, No.3, pp. 131-146, 2006, DOI:10.3970/cmc.2006.003.131

Abstract Novel textile reinforced composites provide an extremely high adaptability and allow for the development of materials whose features can be adjusted precisely to certain applications. A successful structural and material design process requires an integrated simulation of the material behavior, the estimation of the effective properties which need to be assigned to the macroscopic model and the resulting features of the component. In this context two efficient modelling strategies - the Binary Model (Carter, Cox, and Fleck (1994)) and the Extended Finite Element Method (X-FEM) (Moës, Cloirec, Cartraud, and Remacle (2003)) - are used to model materials which exhibit a… More >

Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >