Ching-Chi Hsu¹, Jinn Lin², Yongyut Amaritsakul³, Takalamesar Antonius³, Ching-Kong Chao^3,4

CMC-Computers, Materials & Continua, Vol.11, No.1, pp. 1-14, 2009, DOI:10.3970/cmc.2009.011.001

Abstract Dynamic hip screw and gamma nail have been widely used to treat the patients with proximal femoral fractures, but clinical failures of those implants are still to be found. This study developed three-dimensional finite element models to investigate the biomechanical performances of the implants. Two kinds of commercially available implants (dynamic hip screw and gamma nail) and one newly designed implant (double screw nail) under three kinds of the proximal femoral fractures (neck fracture, subtrochanteric fracture, and subtrochanteric fracture with gap) were evaluated. Double screw nail showed better biomechanical performances than dynamic hip screw and gamma nail. Two commercially available… More >

Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >