Peter Kasten^a, Severin Zimmermann^a, Manish K. Tiwari^a, Bruno Michel^b, Dimos Poulikakos^a,*

Frontiers in Heat and Mass Transfer, Vol.1, No.2, pp. 1-10, 2010, DOI:10.5098/hmt.v1.2.3006

Abstract Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with 60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water outlet temperature from the heat sink opens the possibility of waste heat recovery applications. More >

M. Yakut Ali^a,*, Fanghao Yang^a, Ruixian Fang^a, Chen Li^a, Jamil Khan^a,†

Frontiers in Heat and Mass Transfer, Vol.2, No.3, pp. 1-11, 2011, DOI:10.5098/hmt.v2.3.3003

Abstract This study experimentally investigates single phase heat transfer and pressure drop characteristics of a shallow rectangular microchannel heat sink whose surface is enhanced with copper nanowires (CuNWs). The hydraulic diameter of the channel is 672 μm and the bottom wall is coated with Cu nanowires (CuNWs) of 200 nm in diameter and 50 μm in length. CuNWs are grown on the Cu heat sink by electrochemical synthesis technique which is inexpensive and readily scalable. The heat transfer and pressure drop results of CuNWs enhanced heat sink are compared with that of bare copper surface heat sink using deionized (DI) water… More >

Ralph L. Webb

Frontiers in Heat and Mass Transfer, Vol.2, No.2, pp. 1-5, 2011, DOI:10.5098/hmt.v2.2.3001

Abstract This paper discusses the “Inlet Temperature Difference” (ITD) based heat-exchanger (and its variants) design methodology frequently used by designers of electronic heat sinks. The methodology is at variance with the accepted methodology recommended in standard heat-transfer text books – the “Log-Mean Temperature Difference” (LMTD), or the equivalent “effectiveness-NTU” design method. The purpose of this paper is to evaluate and discuss the ITD based design methodology and its deficiencies. The paper shows that the ITD based method is an approximation at best. Variants of the method can lead to either under or over prediction of the heat transfer rate. Its shortcomings… More >

Keyong Cheng^a,b,*, Chunzi Zhang^c, Wei Chen^a,b, Shiqiang Liang^a,†, Yongxian Guo^a,d, Xiulan Huai^a

Frontiers in Heat and Mass Transfer, Vol.3, No.3, pp. 1-6, 2012, DOI:10.5098/hmt.v3.3.3003

Abstract A film cooling method with chemical heat sink for gas turbine blades is proposed. In this method, an endothermic reaction of cooling stream occurs due to the heating from the mainstream, which leads to an improvement of film cooling effectiveness. The proposed method at different blowing ratios are computed and compared with the conventional one. The simulation result shows that due to the exsitence of the chemical heat sink the proposed method can enhance film cooling effectiveness not only in the streamwise direction, but also in the spanwise direction. More >

Md. Farhad Ismail^a,*, M.A.I. Rashid^b , M. Mahbub^b

Frontiers in Heat and Mass Transfer, Vol.3, No.3, pp. 1-8, 2012, DOI:10.5098/hmt.v3.3.3002

Abstract Carbon nanotube (CNT) has been proven to be an effective material for the thermal management of MEMS-based devices due to its superior thermal conductivity. At the same time, micro-channel heat-sinks are widely used in electronic products as a high performance heat transfer device because of its simple construction, easy fabrication process and effective heat removal capability. A numerical study has been carried out to investigate the thermal-fluid characteristics of the aligned and staggered MWCNT (multi walled CNT) based micro pin fins having 650 µm long with hydraulic diameter of ~130 µm. Average heat transfer coefficients have been obtained for effective… More >

Ankit Kanor, R Manimaran^*

Frontiers in Heat and Mass Transfer, Vol.7, pp. 1-5, 2016, DOI:10.5098/hmt.7.25

Abstract One of the effective liquid cooling techniques for microelectronic devices is attaching micro channel heat sink to the inactive side of chip. A micro channel heat sink is a device that decreases temperature by flowing coolant through micro channels. The present study focuses on the conjugate heat transfer analyses for different cross-sections (trapezoidal, hexagonal, octagonal and circular).After present study is validated with the published result in the literature, the comparative study of parallel and counter flow configuration is performed. Different geometries are modeled using CATIA V5 software and simulated in ANSYS Fluent R14. From these CFD simulations, preferred configuration of… More >

Mirmanto^*, I.B. Alit, I.M.A. Sayoga, R. Sutanto, Nurchayati, A. Mulyanto

Frontiers in Heat and Mass Transfer, Vol.10, pp. 1-7, 2018, DOI:10.5098/hmt.10.34

Abstract A comparison study of the use of two different heat removal units was conducted to examine the performance of thermoelectric cooler box. The heat removal units employed were a heat sink fin-fan and a double fan heat pipe. Parameters measured as performance indicators are cooling capacity, temperature differences, and COP. In addition, the effect of electrical power on temperature difference and COP was also investigated. The cooler box size is 285 mm x 245 mm x 200 mm and constructed from styrofoam. The results show that there is no difference of the use of a double fan heat pipe or… More >

S. Palaniammal¹ , K. Saritha^2,*

Frontiers in Heat and Mass Transfer, Vol.10, pp. 1-10, 2018, DOI:10.5098/hmt.10.1

Abstract This paper investigates heat and mass transfer of a MHD Casson fluid over a permeable stretching surface in the presence of a temperature gradient heat sink. The effects of viscous dissipation, thermal radiation and chemical reaction are also taken into the consideration. The relevant similarity transformations are used to reduce the governing equations into a system of nonlinear ordinary differential equations and then solved analytically. The influence of various physical parameters on the velocity, temperature, concentration, skin friction coefficient, Nusselt and Sherwood numbers are investigated. The numerical results of skin friction factor, Nusselt and Sherwood number are compared with the… More >

Weera Punin^*, Somchai Maneewan, Chantana Punlek

Frontiers in Heat and Mass Transfer, Vol.11, pp. 1-5, 2018, DOI:10.5098/hmt.11.22

Abstract In the present experimental investigation, ethylene glycol cooling in a plate-fin heat sink was attached inside an aluminum cooling block for the cooling unit of a thermoelectric (TE) power generator system. The plate-fin heat sink with two different fin heights was made from aluminum with length, width and base thickness of 300, 200, and 25 mm, respectively. The ethylene glycol was used as a coolant. The effects of fin height, coolant volume flow rate, and hot side surface temperature were considered for the temperature differences between the hot side surface and cold side surface of the TE power module. The… More >

Chadwick D. Sevart^* , Theodore L. Bergman

Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-18, 2019, DOI:10.5098/hmt.13.18

Abstract A design approach is proposed and demonstrated to identify desirable two-dimensional solid geometries, cooled by natural convection, that offer superior thermal performance in terms of reduced overall (conduction-convection) thermal resistance. The approach utilizes (i) heat transfer modeling in conjunction with (ii) various novel shape evolution rules. Predictions demonstrate the evolution of the solid shape and associated reduction of the overall thermal resistance. Parametric simulations reveal the dependence of the predicted solid shape on the evolution rule employed, the thermal conductivity of the solid material, and the strength of advection within the fluid. More >