Zhenjun Tang^1,*, Man Ling¹, Heng Yao¹, Zhenxing Qian², Xianquan Zhang¹, Jilian Zhang³, Shijie Xu¹

CMC-Computers, Materials & Continua, Vol.55, No.2, pp. 331-344, 2018, DOI:10.3970/cmc.2018.02222

Abstract Image hashing is a useful multimedia technology for many applications, such as image authentication, image retrieval, image copy detection and image forensics. In this paper, we propose a robust image hashing based on random Gabor filtering and discrete wavelet transform (DWT). Specifically, robust and secure image features are first extracted from the normalized image by Gabor filtering and a chaotic map called Skew tent map, and then are compressed via a single-level 2-D DWT. Image hash is finally obtained by concatenating DWT coefficients in the LL sub-band. Many experiments with open image datasets are carried out and the results illustrate… More >

A.J. Shaw¹ and P.D. Gosling^1,2

CMC-Computers, Materials & Continua, Vol.18, No.3, pp. 237-270, 2010, DOI:10.3970/cmc.2010.018.237

Abstract This article has no abstract. More >

Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >