Open Access iconOpen Access

REVIEW

A Review of Soy-Tannin Gelling for Resins Applications

Antonio Pizzi*

LERMAB-ENSTIB, University of Lorraine, 27 rue Philippe, Seguin, Epinal, 88000, France

* Corresponding Author: Antonio Pizzi. Email: email

(This article belongs to the Special Issue: Renewable and Biosourced Adhesives-2021)

Journal of Renewable Materials 2023, 11(1), 1-25. https://doi.org/10.32604/jrm.2022.023314

Abstract

Soy flour (SF), soy protein and soy protein isolates (SPI) have been the focus of increasing research on their application as new materials for a variety of applications, mainly for wood adhesives and other resins. Tannins too have been the focus of increasing research for similar applications. While both materials are classed as non-toxic and have achieved interesting results the majority of the numerous and rather inventive approaches have still relied on some sort of hardeners or cross-linkers to bring either of them or even their combination to achieve acceptable results. The paper after a presentation of the two materials and their characteristics concentrates on the formation of gels, gelling and even hardening in the case of soy-tannin combined resins. The chapter than finishes with details of the formation of resins giving suitable wood adhesive of acceptable performance by the covalent coreaction of soy protein and tannin without any other hardener, thus totally bio-sourced, non-toxic and environment friendly as a base of further advances to expect in future by these two materials combination.

Keywords


Cite This Article

APA Style
Pizzi, A. (2023). A review of soy-tannin gelling for resins applications. Journal of Renewable Materials, 11(1), 1-25. https://doi.org/10.32604/jrm.2022.023314
Vancouver Style
Pizzi A. A review of soy-tannin gelling for resins applications. J Renew Mater. 2023;11(1):1-25 https://doi.org/10.32604/jrm.2022.023314
IEEE Style
A. Pizzi, “A Review of Soy-Tannin Gelling for Resins Applications,” J. Renew. Mater., vol. 11, no. 1, pp. 1-25, 2023. https://doi.org/10.32604/jrm.2022.023314



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
  • 2394

    View

  • 1117

    Download

  • 2

    Like

Share Link