Vol.16, Suppl.2, 2019, pp.146-146, doi:10.32604/mcb.2019.07074
OPEN ACCESS
ABSTRACT
Microspheres Modified with the Heparin Increasing the Length of Molecular Linker to Better Capture the Endotoxin
  • Qi Dang1, Chun-Gong Li1, Xin-Xin Jin1, Ya-Jin Zhao1, Xiang Wang1,*
1 Key Laboratory of Biorheological Science and Technology, Ministry of Education, College of Bioengineering, Chongqing University, Chongqing 400030, PR China.
* Corresponding author: Xiang Wang. E-mail: xwangchn@vip.sina.com.
Abstract
Endotoxin is a a very powerful and toxic inflammatory stimulator usually leading to the sepsis occurred. In order to remove endotoxin better through hemoperfusion, it is a pretty choice to increase the length of molecular linker on adsorbents. In this study, we chose the heparin as a molecular linker because of its being anticoagulant linear polysaccharide. Heparin as a linker was covalently immobilized on the chloromethylated polystyrene microspheres (Ps) and then connected with L-phenylalanine (Phe) forming the Ps-Hep-Phe structure to adsorbed endotoxin better. The property of microspheres was characterized by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, zeta potential and water contact angle. The hydrophilicity was improved after immobilization. The adsorption capacity of Ps-Hep-Phe for endotoxin adsorption was higher than that of Ps-Phe (No heparin). And the adsorbents with the heparin as a linker simultaneously showed the prolonged clotting times, low protein adsorption, and reduced the hemolysis rate, indicating that heparin as a molecular linker could play an important role in anticoagulation. Therefore, this study implied that heparin would be a promising strategy for adsorbents modification in hemoperfusion.
Keywords
Heparin; linker; anticoagulation; L-phenylalanine; endotoxin
Cite This Article
Dang, Q., Li, C., Jin, X., Zhao, Y., Wang, X. (2019). Microspheres Modified with the Heparin Increasing the Length of Molecular Linker to Better Capture the Endotoxin. Molecular & Cellular Biomechanics, 16(Suppl.2), 146–146.
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