M. N. Noui-Mehidi¹

FDMP-Fluid Dynamics & Materials Processing, Vol.7, No.2, pp. 141-152, 2011, DOI:10.3970/fdmp.2011.007.141

Abstract The present work is concerned with a numerical study of the performance of a conical annular centrifugal contractor through the analysis of the flow properties when the apex angle is changed for different imposed axial flows. The calculations revealed the advantage of using conical annular centrifugal contractors compared to the cylindrical annular centrifuges. The study is conducted by a comparison analysis of the hydrodynamics of fluid flow in both conical and cylindrical contractors where moderate axial flows are imposed. In both systems the outer body is stationary while the inner rotor is maintained at constant speed. The calculations are achieved… More >

Morteza Eslamian^1,2, M. Ziad Saghir^1,3

FDMP-Fluid Dynamics & Materials Processing, Vol.8, No.4, pp. 353-380, 2012, DOI:10.3970/fdmp.2012.008.353

Abstract In this paper recent advances pertinent to the applications of thermodiffusion or thermomigration in the fabrication of micro and nano metal-doped semiconductor-based patterns and devices are reviewed and discussed. In thermomigration, a spot, line, or layer of a p-type dopant, such as aluminum, which is deposited on a semiconductor surface, penetrates into the semiconductor body due to the presence of a temperature gradient applied across the wafer body. The trails of p-doped regions within an n-type semiconductor, in the form of columns or walls, may be used for several applications, such as the isolation of a part of a semiconductor… More >

Walter Gerstle¹, Stewart Silling², David Read³, Vinod Tewary⁴, Richard Lehoucq⁵

CMC-Computers, Materials & Continua, Vol.8, No.2, pp. 75-92, 2008, DOI:10.3970/cmc.2008.008.075

Abstract A theoretical framework, based upon the peridynamic model, is presented for analytical and computational simulation of electromigration. The framework allows four coupled physical processes to be modeled simultaneously: mechanical deformation, heat transfer, electrical potential distribution, and vacancy diffusion. The dynamics of void and crack formation, and hillock and whisker growth can potentially be modeled. The framework can potentially be applied at several modeling scales: atomistic, crystallite, multiple crystallite, and macro. The conceptual simplicity of the model promises to permit many phenomena observed in microchips, including electromigration, thermo-mechanical crack formation, and fatigue crack formation, to be analyzed in a systematic and… More >

Marcello Lappa ¹

CMC-Computers, Materials & Continua, Vol.2, No.1, pp. 51-64, 2005, DOI:10.3970/cmc.2005.002.051

Abstract A possible approach for the investigation of a number of aspects related to the processing of immiscible alloys, made possible by recent progress in both fields of moving boundary (VOF) methods and speed of computers, is discussed. It can capture in a single numerical treatment and without limiting assumptions both macroscopic information (i.e. the macrophysical problem, heretofore treated in terms of population dynamics) and microscopic details (i.e. the microphysical problem, heretofore treated within the framework of boundary integral methods and/or under the assumption of nondeformable drops). The role played by coalescence in changing the Marangoni migration velocity is discussed together… More >