Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >

Lingfei Gao¹, Xiaoping Zheng^1,2, Zhenhan Yao¹

CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 25-36, 2006, DOI:10.3970/cmc.2007.003.025

Abstract A general numerical approach is developed to model the elastic behaviours and failure processes of heterogeneous materials. The heterogeneous material body is assumed composed of a large number of convex polygon lattices with different phases. These phases are locally isotropic and elastic-brittle with the different lattices displaying variable material parameters and a Weibull-type statistical distribution. When the effective strain exceeds a local fracture criterion, the full lattice exhibits failure uniformly, and this is modelled by assuming a very small Young modulus value. An auto-select loading method is employed to model the failure process. The proposed hybrid approach is applied to… More >

I. Smojver¹, J. Sorić²

CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 13-24, 2006, DOI:10.3970/cmc.2007.003.013

Abstract The paper addresses the problem of impact on layered fibre composites. The behaviour of composite laminates under impact loading is dependent not only on the velocity but also on the mass and geometry of the impactor. Using micromechanical Mori-Tanaka approach, mechanical properties of the laminate have been calculated utilizing the material constants of the fibre and matrix. General purpose FEM software ABAQUS has been modified by means of user written subroutines for modelling of composite laminate and rigid impactor. The kinematics of the impact has been simulated using transient dynamic analysis. Employing user defined multi point constraints, delamination zones have… More >

G. Mishuris¹, A. Öchsner², G. Kuhn³

CMC-Computers, Materials & Continua, Vol.2, No.4, pp. 227-238, 2005, DOI:10.3970/cmc.2005.002.227

Abstract FEM-evaluation of imperfect transmission conditions has been performed for a modelling problem of an elastic structure with a thin intermediate interface. Very good correlations with theoretical results have been obtained. Additionally, the possible error connected with introducing the transmission conditions instead of the intermediate zone has been estimated depending on mechanical properties of the zone. More >

A. Cazzani¹, E. Garusi², A. Tralli³, S.N. Atluri⁴

CMC-Computers, Materials & Continua, Vol.2, No.1, pp. 23-38, 2005, DOI:10.3970/cmc.2005.002.023

Abstract Fibre-reinforced plates and shells are finding an increasing interest in engineering applications. Consequently, efficient and robust computational tools are required for the analysis of such structural models. As a matter of fact, a large amount of laminate finite elements have been developed and incorporated in most commercial codes for structural analysis. \newline In this paper a new laminate hybrid assumed-strain plate element is derived within the framework of the First-order Shear Deformation Theory (i.e. assuming that particles of the plate originally lying along a straight line which is normal to the undeformed middle surface remain aligned along a straight line… More >