Qiuren Ou^1,2,*, Peijun Ji², Jun Xiao¹, Ling Wu²

FDMP-Fluid Dynamics & Materials Processing, Vol.15, No.1, pp. 27-37, 2019, DOI:10.32604/fdmp.2019.04787

Abstract The properties of resin transfer molding (RTM) cyanate ester and its T800 grade carbon fiber composites were studied with the rheometer, differential scanning calorimetry (DSC), FT-IR, dynamic mechanical analyzer (DMA), thermal gravimetric analysis (TGA), mechanical property testing, and scanning electron microscopy (SEM). The results showed that the temperature of cyanate ester suitable for RTM process was 70℃. Curing process of the resin was 130℃/2 h+160℃/2 h+200℃/2 h+220℃/4 h. Glass transition temperature and heat decomposition temperature of the cured resin are 289℃ and 415℃, respectively. Mechanical properties of T800/RTM cyanate composites are 13.5% higher than that of T700/RTM cyanate composites and… More >

S. Fashu^{1 *}, M.Tozvireva¹, L.Mudzingwa¹, R.Khan², A. Mukuya¹

FDMP-Fluid Dynamics & Materials Processing, Vol.12, No.4, pp. 173-192, 2016, DOI:10.3970/fdmp.2016.012.173

Abstract This paper outlines the findings in the comparison of the influence of mechanical and electromagnetic stirring on ingot long term purity and uniformity during Ohno Continuous Casting. The magnitude of the average optimum velocity flow field and stirring parameters required to effectively purify aluminum ingots using mechanical stirring of the melt was determined and analyzed. Basing on the determined optimum mechanical flow field, electromagnetic parameters producing almost the same flow field near the interface were obtained through careful adjustments of parameters. Optimum parameters of the mechanical and electromagnetic stirring were obtained by numerically solving the solidification model coupled with either… More >

Y.H. Liu¹, X.X. Xue², J.M.Shen¹

FDMP-Fluid Dynamics & Materials Processing, Vol.11, No.2, pp. 197-204, 2015, DOI:10.3970/fdmp.2015.011.195

Abstract Blends of Polyethylene (PE) and modified-oil shale ash (MOSA) with different fractions of MOSA were prepared by the melting blend method. The effects of MOSA content on the rheological and mechanical properties of the blend were properly assessed via direct experimental analysis (more precisely, all rheological measurements were performed using a laboratory-scale XSS-300 torque rheometer with single screw extruder; the temperatures were maintained at 170°C, 180°C and 190°C under continuous extrusion). The prepared samples were observed to display a shear-thinning behaviour. Moreover, with increasing the MOSA content, we found the yield strength of the blends to increase, while its elongation… More >

Yu. Gaponenko¹, I. Ryzhkov², V. Shevtsova³

FDMP-Fluid Dynamics & Materials Processing, Vol.6, No.1, pp. 75-98, 2010, DOI:10.3970/fdmp.2010.006.075

Abstract Gas-liquid flows in annulus are analyzed for fluids in large range of viscosity ratios. The geometry corresponds to a liquid bridge co-axially placed into an outer cylinder with solid walls. The internal core consists of solid rods at the bottom and top, while the central part is a relatively short liquid zone filled with viscous liquid and kept in its position by surface tension. The gas enters into the annular duct and entrains initially quiescent liquid. The flow structures in the liquid and gas are obtained numerically for different shapes of solid rods. Solution for fully developed flow in annulus… More >

Morteza Eslamian^1,2, M. Ziad Saghir^1,3

FDMP-Fluid Dynamics & Materials Processing, Vol.8, No.4, pp. 353-380, 2012, DOI:10.3970/fdmp.2012.008.353

Abstract In this paper recent advances pertinent to the applications of thermodiffusion or thermomigration in the fabrication of micro and nano metal-doped semiconductor-based patterns and devices are reviewed and discussed. In thermomigration, a spot, line, or layer of a p-type dopant, such as aluminum, which is deposited on a semiconductor surface, penetrates into the semiconductor body due to the presence of a temperature gradient applied across the wafer body. The trails of p-doped regions within an n-type semiconductor, in the form of columns or walls, may be used for several applications, such as the isolation of a part of a semiconductor… More >

Hsien-Chie Cheng^1,2, Chien-Hao Ma¹, Ching-Feng Yu³, Su-Tsai Lu⁴, Wen-Hwa Chen^2,3

CMC-Computers, Materials & Continua, Vol.38, No.3, pp. 129-154, 2013, DOI:10.3970/cmc.2013.038.129

Abstract User experiences for electronic devices with high portability and flexibility, good intuitive human interfaces and low cost have driven the development of semiconductor technology toward flexible electronics and display. In this study proposes, an advanced flexible interconnect technology is proposed for flexible electronics, in which an ultra-thin IC chip having a great number of micro-bumps is bonded onto a very thin flex substrate using an epoxy-based anisotropic conductive film (ACF) to form fine-pitch and reliable interconnects or joints (herein termed ACF-typed thin-flip-chip-on-flex (TFCOF) technology). The electrical and thermal -mechanical performances of the micro-joints are the key to the feasibility and… More >

D.T. Fullwood¹, S.R. Kalidindi², B.L. Adams¹, S. Ahmadi¹

CMC-Computers, Materials & Continua, Vol.9, No.1, pp. 25-40, 2009, DOI:10.3970/cmc.2009.009.025

Abstract Localization relations arise naturally in the formulation of multi-scale models. They facilitate statistical analysis of local phenomena that may contribute to failure related properties. The computational burden of dealing with such relations is high and recent work has focused on spectral methods to provide more efficient models. Issues with the inherent integrations in the framework have led to a tendency towards calibration-based approaches. In this paper a discrete Fourier transform framework is introduced, leading to an extremely efficient basis for the localization relations. Previous issues with the Green's function integrals are resolved, and the method is validated against finite element… More >

Walter Gerstle¹, Stewart Silling², David Read³, Vinod Tewary⁴, Richard Lehoucq⁵

CMC-Computers, Materials & Continua, Vol.8, No.2, pp. 75-92, 2008, DOI:10.3970/cmc.2008.008.075

Abstract A theoretical framework, based upon the peridynamic model, is presented for analytical and computational simulation of electromigration. The framework allows four coupled physical processes to be modeled simultaneously: mechanical deformation, heat transfer, electrical potential distribution, and vacancy diffusion. The dynamics of void and crack formation, and hillock and whisker growth can potentially be modeled. The framework can potentially be applied at several modeling scales: atomistic, crystallite, multiple crystallite, and macro. The conceptual simplicity of the model promises to permit many phenomena observed in microchips, including electromigration, thermo-mechanical crack formation, and fatigue crack formation, to be analyzed in a systematic and… More >

Huanchun Chen¹, Kunigal Shivakumar¹

CMC-Computers, Materials & Continua, Vol.8, No.1, pp. 33-42, 2008, DOI:10.3970/cmc.2008.008.033

Abstract Thermal cycling degradation effect on tensile and flexural properties of Cytec T650 carbon/Lonza Primaset PT-30 cyanate ester composite rods used for gas turbine engine brush seals was evaluated. The composite rods were thermal cycled in air from room temperature to 315°C for 100, 200, 400, 600 and 800 cycles. Each thermal cycle is a one hour period with 28 minutes hold at peak temperature and a high heating/cooling rate of 73°C/min. The composite withstood the first 100 thermal cycles with less than 10% property change. After that, tensile strength and fracture strain as well as flexural modulus were gradually reduced.… More >

Arnab Chakrabarty¹, Tahir Çağin¹

CMC-Computers, Materials & Continua, Vol.7, No.3, pp. 167-190, 2008, DOI:10.3970/cmc.2008.007.167

Abstract The excellent set of properties of carbon nanotube and carbon nanotube-based nanostructures has been established by various studies. However the claimed property values and trends have not been unanimously agreed upon. Using state of the art molecular dynamics and ab initio methods, we have extensively studied the mechanical, thermal and structural properties of carbon nanotubes and carbon nanotube based nanostructures. Additionally this study aims to address the approaches used in various studies to assess the validity and influence of various definitions used for determining the physical properties as reported in earlier experiments and theoretical calculations. We have come up with… More >