Open Access
REVIEW
Advances in Thermoelectric Cooling Applications: A Review
Fatima Naji Hadi, Saif W. Mohammed Ali*
Department of Mechanical Engineering, Faculty of Engineering, University of Kufa, Najaf, Iraq
* Corresponding Author: Saif W. Mohammed Ali. Email: 
Frontiers in Heat and Mass Transfer https://doi.org/10.32604/fhmt.2026.086335
Received 28 May 2026; Accepted 23 July 2026; Published online 31 August 2026
Abstract
Recently, the thermoelectric cooler (TEC) has become popular as a technology that can provide cooling in a solid state because of its small size, high temperature control accuracy, silent operation, and environmental friendliness. Since the technology does not involve any refrigerants and moving components, it is appropriate for reliable localized cooling compared to vapor compression systems. Nevertheless, there are certain disadvantages associated with low efficiency and poor heat dissipation. This paper is dedicated to the review of recent developments in TEC technology, which concentrates mainly on aspects of performance and design determined by the application. The review will be organized depending on different application areas, such as space cooling of various scales (including automotive systems), combined vapor compression refrigeration, and enclosed cavities. Moreover, new applications of TEC in the field of wearable cooling and clothing thermal management, along with aerospace, microchip cooling in electronics, and battery thermal management, will be reviewed.
Keywords
Thermoelectric cooler (TEC); enclosed-space cooling; peltier effect; diversified applications
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