Home / Advanced Search

  • Title/Keywords

  • Author/Affliations

  • Journal

  • Article Type

  • Start Year

  • End Year

Update SearchingClear
  • Articles
  • Online
Search Results (48)
  • Open Access

    ARTICLE

    Comparison between a Cohesive Zone Model and a Continuum Damage Model in Predicting Mode-I Fracture Behavior of Adhesively Bonded Joints

    K.I. Tserpes1, A.S. Koumpias1

    CMES-Computer Modeling in Engineering & Sciences, Vol.83, No.2, pp. 169-182, 2012, DOI:10.32604/cmes.2012.083.169

    Abstract In this work, a comparison between a cohesive zone model and a continuum damage model in predicting the mode-I fracture behavior of adhesively bonded joints is performed on the basis of reliability and applicability. The cohesive zone model (CZM) is based on an exponential traction law characterizing the behavior of the interface elements. The continuum damage model (CDM) is based on the stiffness degradation of adhesive elements imposed by a damage parameter. Both models have been implemented by means of a 3D finite element model. Mode-I fracture behavior of the bonded joints was characterized using the DCB specimen. Firstly, the… More >

  • Open Access

    ARTICLE

    Constitutive Contact Laws in Structural Dynamics

    K.Willner 1

    CMES-Computer Modeling in Engineering & Sciences, Vol.48, No.3, pp. 303-336, 2009, DOI:10.3970/cmes.2009.048.303

    Abstract The dynamic behavior of structures with joints is strongly influenced by the constitutive behavior within the contact areas. In this paper the influence of an elaborate constitutive contact model based on a rough surface model is investigated. The contact model is able to describe several effects like pressure dependent contact stiffness in normal and tangential direction as well as microslip effects. The corresponding constitutive contact laws are implemented in a finite element code. Numerical simulations are compared to experimental results of a clamped double-beam experiment. More >

  • Open Access

    ARTICLE

    Investigation of Inherent Deformation in Fillet Welded Thin Plate T-joints Based on Interactive Substructure and Inverse Analysis Method

    Rui Wang1, Jianxun Zhang1, Hisashi Serizawa2, Hidekazu Murakawa2

    CMES-Computer Modeling in Engineering & Sciences, Vol.44, No.1, pp. 97-114, 2009, DOI:10.3970/cmes.2009.044.097

    Abstract In this paper, the inherent deformation of fillet welded thin plate T-joints is studied. The prediction procedure of inherent deformation consists of three parts: part one, a three dimensional (3D) thermo-elastic-plastic analysis using an in house finite element (FE) code of interactive substructure method (ISM) is utilized to obtain the welding distortions; part two, corresponding experiments are carried out to verify the computational results of ISM; part three, using the verified computational results, the inverse analysis is utilized to evaluate the welding inherent deformation. Based on the results in this study, an inherent deformations database of fillet welded thin plate… More >

  • Open Access

    ARTICLE

    Intensity of stress singularity at a vertex and along the free edges of the interface in 3D-dissimilar material joints using 3D-enriched FEM

    W. Attaporn1, H. Koguchi2

    CMES-Computer Modeling in Engineering & Sciences, Vol.39, No.3, pp. 237-262, 2009, DOI:10.3970/cmes.2009.039.237

    Abstract In the present study, a stress singularity field along free edges meeting at a corner in a three-dimensional joint structure is investigated. The order of stress singularity is determined using an eigen analysis based on a finite element method. Intensities of stress singularity not only at the corner but also along the free edge of interface are determined directly without any post-processing by a new FEM formulation referred to as a three-dimensional enriched FEM. Result in the present analysis is also compared with that in another numerical method. It was slightly larger than the intensity of stress singularity, which was… More >

  • Open Access

    ARTICLE

    Modeling of Structural Sandwich Plates with `Through-the-Thickness' Inserts: Five-Layer Theory

    Song-Jeng Huang1,2, Lin-Wei Chiu2

    CMES-Computer Modeling in Engineering & Sciences, Vol.34, No.1, pp. 1-32, 2008, DOI:10.3970/cmes.2008.034.001

    Abstract The composite sandwich plate is one of the most common composite structures. Local stress concentrations can be caused by localized bending effects where a load is introduced. Although a sandwich structure with an insert is one of the classical load bearing structures, little work has been conducted on the adhesive layers or inserts. This study involves a linear elasticity analysis of five-layer sandwich plates with ``through-the-thickness'' inserts, using sandwich plate theory to analyze deformation behavior. Governing equations are formulated as partial differential equations, which are solved numerically using the multi-segment integration method. Sandwich plates with ``through-the-thickness'' inserts subjected to axisymmetric… More >

  • Open Access

    ARTICLE

    Numerical Simulation of Fatigue Crack Growth in Microelectronics Solder Joints

    K. Kaminishi1, M. Iino2, H. Bessho2, M. Taneda3

    CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 107-110, 2000, DOI:10.3970/cmes.2000.001.107

    Abstract An FEA (finite element analysis) program employing a new scheme for crack growth analysis is developed and a prediction method for crack growth life is proposed. The FEA program consists of the subroutines for the automatic element re-generation using the Delaunay Triangulation technique, the element configuration in the near-tip region being provided by a super-element, elasto-inelastic stress analyses, prediction of crack extension path and calculation of fatigue life. The FEA results show that crack extension rate and path are controlled by a maximum opening stress range, Δσθmax, at a small radial distance of r = d, where d is chosen… More >

  • Open Access

    ARTICLE

    Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints

    Hsien-Chie Cheng1,2, Chien-Hao Ma1, Ching-Feng Yu3, Su-Tsai Lu4, Wen-Hwa Chen2,3

    CMC-Computers, Materials & Continua, Vol.38, No.3, pp. 129-154, 2013, DOI:10.3970/cmc.2013.038.129

    Abstract User experiences for electronic devices with high portability and flexibility, good intuitive human interfaces and low cost have driven the development of semiconductor technology toward flexible electronics and display. In this study proposes, an advanced flexible interconnect technology is proposed for flexible electronics, in which an ultra-thin IC chip having a great number of micro-bumps is bonded onto a very thin flex substrate using an epoxy-based anisotropic conductive film (ACF) to form fine-pitch and reliable interconnects or joints (herein termed ACF-typed thin-flip-chip-on-flex (TFCOF) technology). The electrical and thermal -mechanical performances of the micro-joints are the key to the feasibility and… More >

  • Open Access

    ARTICLE

    Failure Analysis of Bolted Joints in Cross-ply Composite Laminates Using Cohesive Zone Elements

    A. Ataş1, C. Soutis2

    CMC-Computers, Materials & Continua, Vol.34, No.3, pp. 199-226, 2013, DOI:10.3970/cmc.2013.034.199

    Abstract A strength prediction method is presented for double-lap single fastener bolted joints of cross-ply carbon fibre reinforced plastic (CFRP) composite laminates using cohesive zone elements (CZEs). Three-dimensional finite element models were developed and CZEs were inserted into subcritical damage planes identified from X-ray radiographs. The method makes a compromise between the experimental correlation factors (dependant on lay-up, stacking sequence and joint geometry) and three material properties (fracture energy, interlaminar strength and nonlinear shear stress-strain response). Strength of the joints was determined from the predicted load-displacement curves considering sub-laminate and plylevel scaling effects. The predictions are in a reasonable agreement with… More >

Displaying 41-50 on page 5 of 48. Per Page