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Hongli Guo1,*, Huanyin Yang1, Suihu Dang1, Shunru Zhang2, Haijun Hou3
1 College of Electronic and Information Engineering, Yangtze Normal University, Fuling, Chongqing, China
2 School of Physics, Electronics and Intelligent Manufacturing, Huaihua University, Huaihua, China
3 School of Materials Engineering, Yancheng Institute of Technology, Yancheng, China
* Corresponding Author: Hongli Guo. Email:
Chalcogenide Letters https://doi.org/10.32604/cl.2026.076290
Received 18 November 2025; Accepted 19 January 2026; Published online 24 February 2026
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