Guest Editor(s)
Prof. Dr. Zhihan Lyu
Email:lvzhihan@gmail.com
Affiliation: Department of Game Design, Faculty of Arts, Uppsala University, P.O. Box 256, Uppsala, 75105, Sweden; Energy Research Institute, Chinese Academy of Sciences, No. 189, Songling Road, Laoshan District, Qingdao, 266100, China
Homepage:
Research Interests: digital twins; meta-universes; virtual reality
Prof. Dr. Bin Yang
Email: binyang@tcu.edu.cn
Affiliation: School of Energy and Safety Engineering, Tianjin Chengjian University, No. 26 Jinjing Road of Xiqing District, Tianjin, 300384, China
Homepage:
Research Interests: thermal environment; intelligent sensing; building energy efficiency; air conditioning control
Dr. Yifan Li
Email:yifan100zixuan@163.com
Affiliation: School of Energy and Safety Engineering, Tianjin Chengjian University, No. 26 Jinjing Road of Xiqing District, Tianjin, 300384, China
Homepage:
Research Interests: electronic chip cooling; micro heat sink; heat transfer enhancement; multi-phase flow; intelligent regulation
Prof. Dr. Thomas Olofsson
Email:thomas.olofsson@umu.se
Affiliation: Department of Applied Physics and Electronics, Umeå University, Håken Gullessons väg 20, Umeå, 901 87, Sweden
Homepage:
Research Interests: data-driven technique; thermal environment; building energy efficiency; building retrofitting
Summary
With the increase of the computing power for data centers, the integration of the transistors per unit area in electronic chips improves, which leads to a sharp increase in transient heat load and local hot spots. The non-uniform load distribution on the chip and the local hot spots in the thermal environment are the key issues of the data centers. The main theme of this Special Issue covers comprehensive and up-to-date knowledge in the field of energy efficiency management, room-level cooling, server/cabinet-level cooling, chip-level cooling, and thermal-humidity environment in data centers. Through a collection of scientific articles and reviews, this Special Issue aims to shed light on the latest achievements in the field of broadly understood thermal management systems in data centers, and modern technological solutions, including intelligence algorithm.
Thank you in advance for your interest, and we look forward to receiving your submissions.
Topics include but are not limited to:
Room-level cooling in data centers
Row-level cooling in data centers
Rack-level cooling in data centers
Chip-level cooling in data centers
Air conditioning technology in data centers
Working fluid feature in cooling system
Geometries, structure and arrangement
Efficient utilization of nature cold sources
Reliability assurance for inevitable faults
Airflow distribution
Thermal environment prediction and control
Keywords
data center; energy efficiency; thermal management; air distribution; multi-scale synergy; intelligent regulation; system optimization
Published Papers
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