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Structural Relaxation and Thermal Robustness of Electron-Beam Evaporated As2Se3 Films for Far-Infrared Heterogeneous Metalenses

Weihang Qiu1, Bo Zhang2, Zhaofeng Gu2,*, Zijun Liu2, Xiang Shen2, Yimin Chen1,2,*
1 Department of Microelectronic Science and Engineering, School of Physical Science and Technology, Ningbo University, Ningbo, China
2 Laboratory of Infrared Material and Devices & Key Laboratory of Photoelectric Materials and Devices of Zhejiang Province, Advanced Technology Research Institute, Ningbo University, Ningbo, China
* Corresponding Author: Zhaofeng Gu. Email: email; Yimin Chen. Email: email

Chalcogenide Letters https://doi.org/10.32604/cl.2026.089518

Received 21 July 2026; Accepted 26 August 2026; Published online 01 September 2026

Abstract

This study presents electron-beam evaporated As2Se3 films tailored for far-infrared heterogeneous metalenses. Characterization via X-ray diffraction and Raman spectroscopy reveals a structurally relaxed network in the films compared to bulk glass, resulting in enhanced infrared transmittance, a reduced refractive index, and a lower glass transition temperature. However, thermal expansion mismatch is found to induce cracking in thick films subjected to thermal cycling. The As2Se3/BaF2 system demonstrates superior adhesion, attributed to a minimal thermal expansion mismatch (Δα < 2.5 × 10−6°C−1). Notably, an 8 μm thick film endures over thirty rapid heating and liquid nitrogen quenching cycles without degradation, while maintaining a subwavelength thickness and optical properties suitable for metalens design. These findings establish the As2Se3/BaF2 platform as a robust candidate for environmentally stable infrared heterogenous metasurfaces.

Keywords

Chalcogenide As2Se3 film; electron-beam evaporation; infrared metalens; structural relaxation; film adhesion
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