Home / Journals / CMC / Vol.11, No.2, 2009
Table of Content
  • Open Access

    ARTICLE

    Analytical Full-field Solutions of a Piezoelectric Layered Half-plane Subjected to Generalized Loadings

    Chien-Ching Ma1,2, Wen-Cha Wu2
    CMC-Computers, Materials & Continua, Vol.11, No.2, pp. 79-108, 2009, DOI:10.3970/cmc.2009.011.079
    Abstract The two-dimensional problem of a planar transversely isotropic piezoelectric layered half-plane subjected to generalized line forces and edge dislocations in the layer is analyzed by using the Fourier-transform method and the series expansion technique. The full-field solutions for displacements, stresses, electrical displacements and electric fields are expressed in explicit closed forms. The complete solutions consist only of the simplest solutions for an infinite piezoelectric medium with applied loadings. It is shown in this study that the physical meaning of this solution is the image method. The explicit solutions include Green's function for originally applied loadings in an infinite piezoelectric medium… More >

  • Open Access

    ARTICLE

    An Investigation into the Mechanical Behavior of Single-Walled Carbon Nanotubes under Uniaxial Tension Using Molecular Statics and Molecular Dynamics Simulations

    Yeau-Ren Jeng1,Ping-Chi Tsai1,Guo-Zhe Huang1, I-Ling Chang1
    CMC-Computers, Materials & Continua, Vol.11, No.2, pp. 109-126, 2009, DOI:10.3970/cmc.2009.011.109
    Abstract This study performs a series of Molecular Dynamics (MD) and Molecular Statics (MS) simulations to investigate the mechanical properties of single-walled carbon nanotubes (SWCNTs) under a uniaxial tensile strain. The simulations focus specifically on the effects of the nanotube helicity, the nanotube diameter and the percentage of vacancy defects on the bond length, bond angle and tensile strength of zigzag and armchair SWCNTs. In this study, a good agreement is observed between the MD and MS simulation results for the stress-strain response of the SWCNTs in both the elastic and the plastic deformation regimes. The MS simulations reveal that in… More >

  • Open Access

    ARTICLE

    The Influence of Structural Defect on Mechanical Properties and Fracture Behaviors of Carbon Nanotubes

    Hsien-Chie Cheng1, Yu-Chen Hsu2, Wen-Hwa Chen2
    CMC-Computers, Materials & Continua, Vol.11, No.2, pp. 127-146, 2009, DOI:10.3970/cmc.2009.011.127
    Abstract Due to the limitation of fabrication technologies nowadays, structural or atomistic defects are often perceived in carbon nanotubes (CNTs) during the manufacturing process. The main goal of the study aims at providing a systematic investigation of the effects of atomistic defects on the nanomechanical properties and fracture behaviors of single-walled CNTs (SWCNTs) using molecular dynamics (MD) simulation. Furthermore, the correlation between local stress distribution and fracture evolution is studied. Key parameters and factors under investigation include the number, type (namely the vacancy and Stone-Wales defects), location and distribution of defects. Results show that the nanomechanical properties of the CNTs, such… More >

  • Open Access

    ARTICLE

    Determination of Temperature-Dependent Elasto-Plastic Properties of Thin-Film by MD Nanoindentation Simulations and an Inverse GA/FEM Computational Scheme

    D. S. Liu1, C. Y. Tsai1, S. R. Lyu2
    CMC-Computers, Materials & Continua, Vol.11, No.2, pp. 147-164, 2009, DOI:10.3970/cmc.2009.011.147
    Abstract This study presents a novel numerical method for extracting the tempe -rature-dependent mechanical properties of the gold and aluminum thin-films. In the proposed approach, molecular dynamics (MD) simulations are performed to establish the load-displacement response of the thin substrate nanoindented at temperatures ranging from 300-900 K. A simple but effective procedure involving genetic algorithm (GA) and finite element method (FEM) is implemented to extract the material constants of the gold and aluminum substrates. The material constants are then used to construct the corresponding stress-strain curve, from which the elastic modulus, yield stress and the tangent modulus of the thin film… More >

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