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Thermofluid Topology Optimization

Submission Deadline: 31 May 2022 (closed)

Guest Editors

Prof. Baotong Li, Xi'an Jiaotong University, China
Prof. Shinji Nishiwaki, Kyoto University, Japan


    With the rapid development of advanced equipment, thermal management has become one of the main challenges that restricts equipment performance. Thermofluid cooling devices are one key to overcome such challenge. More importantly, taking advantage of the topology optimization to design thermal-fluid coupled equipment makes a new way to improve thermal management of complex system under harsh working condition. However, the computation cost of the numerical analysis in thermofluid system is expensive, and the corresponding research on topology optimization is still not enough. Therefore, engineers tend to develop new thermal management devices by modifying previous efficient structures, and the innovation of thermofluid structures is still difficult.

    The difficulties in the topology optimization of thermofluid devices involve three questions:

    1. how to establish rapid and accurate analysis method for thermofluid problem?

    2. how to establish matching optimization method for thermofluid structures?

    3. how to apply topology optimization in engineering?


    In fact, calculation accuracy and computation cost are a pair of contradictions in the classic thermofluid analysis. The time consuming analysis makes the topology optimization infeasible. Besides, the thermofluid analysis involving different scales and fluids also require research in simplification of the fluid model, rapid analysis tools for various types of fluids, and in-depth discussion on the fluid analysis methods’ applicable scenarios.

    In addition, the study on thermofluid topology optimization is not a simple combination of the classic topology optimization method and the thermofluid analysis tool. Researchers need to develop appropriate description scheme for the topology of fluid, modify the generation mode of the fluid structures’ topology, and improve the computational efficiency of the optimization algorithms.

    Besides, constraints including manufacturability, measurability and cost should be considered in engineering application. Thermofluid topology optimization oriented to engineering can help to inspire the research of peers. This special issue also encourages research oriented to engineering requirements.


    Research topics include but are not limited to the following:

  • Novel structural design method oriented to thermofluid problems

  • Novel analysis theory for thermofluid structures

  • Discussion on numerical analysis method for thermofluid field oriented to different working conditions

  • Description method for the topology of various fluid

  • Simplification and modification of navier stokes equation for rapid solution

  • Topology optimization of thermofluid structures at various scales and in various types of engineering systems;

  • Computing method for thermofluid analysis

  • Topology optimization of multiphase thermal-fluid coupled field

  • Mathematical methods for thermal-fluid coupled field

  • Numerical analysis for thermal-fluid coupled field considering scale effect

  • Thermofluid topology optimization in engineering

  • Topology optimization of air cooling structure

  • Topology optimization of liquid cooling structure

  • Efficient computing method in high performance computer


Thermofluid topology optimization; Thermofluid analysis; Simplification of navier stokes equation; Topology description method; Air cooling; Liquid cooling; Efficient computing method

Published Papers

  • Open Access


    Experimental and Numerical Analysis of the Influence of Microchannel Size and Structure on Boiling Heat Transfer

    Ningbo Guo, Xianming Gao, Duanling Li, Jixing Zhang, Penghui Yin, Mengyi Hua
    CMES-Computer Modeling in Engineering & Sciences, Vol.136, No.3, pp. 3061-3082, 2023, DOI:10.32604/cmes.2023.026657
    (This article belongs to this Special Issue: Thermofluid Topology Optimization)
    Abstract Computational fluid dynamics was used and a numerical simulation analysis of boiling heat transfer in microchannels with three depths and three cross-sectional profiles was conducted. The heat transfer coefficient and bubble generation process of three microchannel structures with a width of 80 μm and a depth of 40, 60, and 80 μm were compared during the boiling process, and the factors influencing bubble generation were studied. A visual test bench was built, and test substrates of different sizes were prepared using a micro-nano laser. During the test, the behavior characteristics of the bubbles on the boiling surface and the temperature… More >

  • Open Access


    Topology Optimization of Stiffener Layout Design for Box Type Load-Bearing Component under Thermo-Mechanical Coupling

    Zhaohui Yang, Tianhua Xiong, Fei Du, Baotong Li
    CMES-Computer Modeling in Engineering & Sciences, Vol.135, No.2, pp. 1701-1718, 2023, DOI:10.32604/cmes.2023.022758
    (This article belongs to this Special Issue: Thermofluid Topology Optimization)
    Abstract The structure optimization design under thermo-mechanical coupling is a difficult problem in the topology optimization field. An adaptive growth algorithm has become a more effective approach for structural topology optimization. This paper proposed a topology optimization method by an adaptive growth algorithm for the stiffener layout design of box type load-bearing components under thermo-mechanical coupling. Based on the stiffness diffusion theory, both the load stiffness matrix and the heat conduction stiffness matrix of the stiffener are spread at the same time to make sure the stiffener grows freely and obtain an optimal stiffener layout design. Meanwhile, the objectives of optimization… More >

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