Open Access
REVIEW
Yutong Guo1,2, Jianying Yang1,3, Chao Yang1,3,*
1 Shanghai Key Laboratory of Advanced High-Temperature Materials and Precision Forming, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China
2 International School of Information and Software, Dalian University of Technology, Dalian, China
3 Inner Mongolia Research Institute, Shanghai Jiao Tong University, Hohhot, China
* Corresponding Author: Chao Yang. Email:
Computers, Materials & Continua https://doi.org/10.32604/cmc.2026.077820
Received 17 December 2025; Accepted 23 March 2026; Published online 08 April 2026
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