Open Access
ARTICLE
Kemeng Zhu1, Dingju Zhu1,2,*, Shihua Mao1, Jinchen Wu3, Depeng Kong4, Kaileung Yung5, Andrew W. H. Ip6
1 School of Artificial Intelligence, South China Normal University, Foshan, China
2 School of Computer Science, South China Normal University, Guangzhou, China
3 Guangzhou Vocational College of Technology & Business, Guangzhou University, Guangzhou, China
4 Department of McCormick School of Engineering, Northwestern University, Evanston, IL, USA
5 Department of Industrial and Systems Engineering, Hong Kong Polytechnic University, Hong Kong, China
6 Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, Canada
* Corresponding Author: Dingju Zhu. Email:
Computers, Materials & Continua https://doi.org/10.32604/cmc.2026.082431
Received 16 March 2026; Accepted 21 April 2026; Published online 09 May 2026
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