Open Access
ARTICLE
Chengyu Hou1,2, Wenzao Li2, Hanyun Li3, Kui Liu1, Zhuoning Zhao1, Hongping Shu1,*
1 School of Software Engineering, Chengdu University of Information Technology, Chengdu, China
2 School of Communication Engineering, Chengdu University of Information Technology, Chengdu, China
3 Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China
* Corresponding Author: Hongping Shu. Email:
Computers, Materials & Continua https://doi.org/10.32604/cmc.2026.081575
Received 07 March 2026; Accepted 12 May 2026; Published online 02 June 2026
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