Open Access
ARTICLE
Mingxuan Jia, Chenglong Shi, Yang Ye, Wen Huang, Jian Peng*
College of Computer Science, Sichuan University, Chengdu, China
* Corresponding Author: Jian Peng. Email:
Computers, Materials & Continua https://doi.org/10.32604/cmc.2026.084123
Received 16 April 2026; Accepted 11 July 2026; Published online 03 August 2026
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