Submission Deadline: 31 March 2027 View: 77 Submit to Special Issue
Prof. Dr. Cheng-Fu Yang
Email: cfyang@nuk.edu.tw
Affiliation: Department of Chemical and Materials Engineering, National University of Kaohsiung, Kaohsiung, Taiwan
Research Interests: transparent conduction oxide thin films, silicon-based thin film solar, nanotubes and nanowires, IoT applications, AI applications, finite element analysis for system structure, finite element analysis for optical devices
Prof. Dr. Wenbing Zhao
Email: w.zhao1@csuohio.edu
Affiliation: Department of Electrical and Computer Engineering, Cleveland State University, Cleveland, Ohio, USA
Research Interests: human–computer interaction, blockchain technology, dependable distributed systems, rehabilitation, HCI & computer vision, smart and connected healthcare
Prof. Dr. Teen-Hang Meen
Email: thmeen@gs.nfu.edu.tw
Affiliation: Department of Electronic Engineering, National Formosa University, Yunlin County, Taiwan
Research Interests: photovoltaic devices, FEM for nanotechnology, microgrid systems, AIoT applications, smart technologies
The rapid advancement of micro- and nano-scale engineering technologies has significantly accelerated the development of high-performance devices and intelligent manufacturing systems in fields such as photonics, electronics, sensors, energy systems, biomedical engineering, and advanced manufacturing. As device dimensions continue to shrink, the interactions among electromagnetic, thermal, mechanical, optical, fluidic, and material-related phenomena become increasingly complex. These coupled multi-physics effects strongly influence the performance, reliability, manufacturability, and operational stability of modern engineering systems. Consequently, finite element method (FEM)-based computational modeling has become an essential approach for analyzing, designing, and optimizing micro/nano structured devices and manufacturing processes.
In recent years, advanced computational technologies, including multi-physics simulation, topology optimization, digital twins, machine learning, surrogate modeling, inverse design, and high-performance computing, have been increasingly integrated with FEM platforms to improve the design efficiency and predictive capability of engineering systems. FEM-based approaches provide powerful tools for investigating stress distribution, thermal transport, electromagnetic field propagation, optical absorption, fluid–structure interactions, structural deformation, vibration characteristics, and material behaviors across multiple spatial and temporal scales. These computational techniques have enabled significant advances in the development of MEMS/NEMS devices, semiconductor structures, optical absorbers, nano-material systems, precision manufacturing, and intelligent production systems.
However, modern micro/nano engineering systems and manufacturing environments continue to face critical challenges associated with nonlinear multi-physics coupling, fabrication uncertainty, material heterogeneity, reliability degradation, and process optimization under complex operating conditions. Conventional computational approaches are often insufficient to efficiently address these highly integrated and dynamic engineering problems. Therefore, innovative FEM-based computational frameworks, AI-assisted simulation methods, and intelligent optimization strategies are urgently needed to support next-generation micro/nano device engineering and smart manufacturing technologies.
This special issue aims to establish an interdisciplinary academic platform for researchers and engineers working in computational modeling, finite element simulation, micro/nano engineering, and intelligent manufacturing systems. The issue will focus on recent advances in FEM-based numerical methods, multi-physics analysis, computational optimization, and simulation-driven manufacturing technologies for micro/nano structured devices and advanced production systems. Potential topics include, but are not limited to:
• Finite element modeling of micro/nano structures
• Multi-physics simulation and coupled-field analysis
• MEMS/NEMS device design and optimization
• Computational photonics and plasmonic structures
• Electromagnetic and optical device simulation
• Thermal and mechanical analysis of nano-material systems
• Smart manufacturing and digital twin technologies
• AI-assisted FEM optimization and inverse design
• Reliability analysis and structural integrity evaluation
• Semiconductor device and thin-film simulation
• Additive manufacturing and precision manufacturing systems
• Computational modeling for intelligent production systems
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